XF2M-2015-1A Omron, XF2M-2015-1A Datasheet - Page 7

CONN FPC 20POS 0.5MM PITCH SMD

XF2M-2015-1A

Manufacturer Part Number
XF2M-2015-1A
Description
CONN FPC 20POS 0.5MM PITCH SMD
Manufacturer
Omron
Series
XF2Mr
Datasheets

Specifications of XF2M-2015-1A

Contact Plating
Gold
Connector Type
Top and Bottom Contacts
Number Of Positions
20
Pitch
0.020" (0.50mm)
Ffc, Fcb Thickness
0.30mm
Height Above Board
0.083" (2.10mm)
Mounting Type
Surface Mount, Right Angle
Cable End Type
Straight
Termination
Solder
Locking Feature
Rotary Lock, Backlock
Contact Finish
Gold
Contact Finish Thickness
5.9µin (0.15µm)
Operating Temperature
-30°C ~ 85°C
Current Rating
0.500A
Voltage Rating
50V
Housing Material
Liquid Crystal Polymer (LCP)
Product Type
PCB
Number Of Positions / Contacts
20
Mounting Angle
Straight
Mounting Style
Through Hole
Contact Material
Spring Copper Alloy / Nickel Substrate
Termination Style
Solder Pin
Gender
Receptacle
Pitch Spacing
0.5mm
No. Of Contacts
20
No. Of Rows
1
Ffc/fpc Thickness
0.3mm
Contact Termination
Surface Mount Vertical
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
OR719TR
XF2M20151A

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
XF2M-2015-1A
Manufacturer:
OMRON
Quantity:
12 000
Part Number:
XF2M-2015-1A
Manufacturer:
OMRON/欧姆龙
Quantity:
20 000
Company:
Part Number:
XF2M-2015-1A
Quantity:
1 020
Rotary Backlock Mechanism with 0.3-mm Pitch
• Wide molding wall on the rear bottom of the connector allows greater
• Double-sided contact reduces the number of parts.
• Gold plated with an applicable FPC thickness of 0.2 mm.
■ Ratings and Specifications
■ Dimensions
XF2B-@@45-31A
Rated current
Rated voltage
Contact resistance
Insulation resistance 100 M Ω min. (at 250 V DC)
Withstand voltage
Insertion tolerance
Ambient operating
temperature
Table of Dimensions
Pins (See note 1.)
Rotary Backlock Connector
(0.3-mm Pitch, Double-sided Contact)
RoHS Compliant
freedom in board design.
(1.1)
0.3
(1.4)
17
21
23
25
27
31
33
35
39
41
45
51
61
0.6
0.6
A
B
D
C
XF2B-1745-31A
XF2B-2145-31A
XF2B-2345-31A
XF2B-2545-31A
XF2B-2745-31A
XF2B-3145-31A
XF2B-3345-31A
XF2B-3545-31A
XF2B-3945-31A
XF2B-4145-31A
XF2B-4545-31A
XF2B-5145-31A
XF2B-6155-31A
0.2 A AC/DC
50 V AC/DC
50 m Ω max. (at 20 mV max., 100 mA max.)
250 V AC for 1 min.
20 times
− 30 to 85 ° C
(with no icing or condensation)
(leakage current: 1 mA max.)
Model
0.15
0.12
1.2
10.8 11.4 12.1 13.6
11.4 12.0 12.7 14.2
12.6 13.2 13.9 15.4
14.4 15.0 15.7 17.2
17.4 18.0 18.7 20.2
0.1
A
4.2
5.4
6.0
6.6
7.2
8.4
9.0
9.6 10.2 10.9 12.4
0.55
B
4.8
6.0
6.6
7.2
7.8
9.0
9.6 10.3 11.8
5.5
6.7
7.3
7.9
8.5 10.0
9.7 11.2
C
5.2
5.5
D
7.0
8.2
8.8
9.4
0.5
1.23
0.5
2.1
■ Materials and Finish
Housing LCP resin (UL94V-0)/natural
Slider
Contacts
2
0.3
1.2
±0.07
0.6
1
0.25
±0.02
0.3
±0.05
LCP resin (UL94V-0)/black
Spring copper alloy/nickel substrate (2 μ m),
gold-plated contacts (0.15 μ m)
PCB Mating Dimensions (Top View)
Applicable FPC Dimensions
0.3
0.6
(B+0.6)
±0.02
±0.02
B
A
±0.03
0.6
±0.03
0.6
±0.05
±0.05
0.3
±0.05
+0.04
−0.03
A
B
±0.05
±0.05
0.3
0.8 (Effective interface length)
Two, R0.2 max.
(Effective interface length)
+0.04
−0.03
T=0.2±0.03
(Conductive plating)
0.75
0.75
0.3
1.6
0.3
±0.05
±0.05
±0.05
±0.05
5.4
XF2B
±0.1
2.5
(Reinforcement board)
±0.03
4.5
7

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