DM3D-SF Hirose Electric Co Ltd, DM3D-SF Datasheet - Page 2
![CONN MICRO SD R/A PUSH-PULL SMD](/photos/3/6/30684/dm3d-sf_sml.jpg)
DM3D-SF
Manufacturer Part Number
DM3D-SF
Description
CONN MICRO SD R/A PUSH-PULL SMD
Manufacturer
Hirose Electric Co Ltd
Series
DM3r
Specifications of DM3D-SF
Card Type
Secure Digital - microSD™ TransFlash
Number Of Positions
10 (8 + 2)
Connector Type
Connector
Insertion, Removal Method
Push In, Pull Out
Mounting Type
Surface Mount, Right Angle
Features
Switch
Height Above Board
0.061" (1.55mm)
Mounting Feature
Normal, Standard - Top
Contact Finish
Gold
Product
Card Connectors
Mounting Style
PCB
Termination Style
Solder
Number Of Rows
1
Number Of Contacts
8
Current Rating
0.5 A
Contact Material
Copper Alloy
Contact Plating
Gold
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Contact Finish Thickness
-
Ejector Side
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
HR1941TR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DM3D-SF(00)A
Manufacturer:
HRS
Quantity:
1
2
DM3 Series●microSD™ Card Connectors
■Specifications(DM3 Series)
Note 1: Includes temperature rise caused by current flow.
Note 2. The term "storage" refers to products stored for long period prior to mounting and use.
■Materials and Finishes
DM3AT, DM3BT
DM3CS, DM3D
■Ordering information
1. Insulation resistance
2. Withstanding voltage
3. Contact resistance
4. Vibration
5. Humidity
6. Temperature cycle
7. Durability
8. Resistance to
soldering heat
1
2
Ratings
Series name: DM3
Connector type
Number of contacts : 8
Other components
Item
Guide cover
Guide cover
Contacts
Contacts
Insulator
Insulator
Part
Part
Current rating: 0.5A
Voltage rating: 125V AC
: AT Push-Push (ejection mechanism), Top board mounting (Standard)
1000 Mø min. (Initial value)
No flashover or insulation breakdown
100mø max. (Initial value)
No electrical discontinuity of 100 ns or longer
No damage, cracks or parts dislocation.
Contact resistance: 40 mø max. (change from initial value)
Insulation resistance: 100 Mø min.
No damage, cracks or parts dislocation.
Contact resistance: 40 mø max. (change from initial value)
Insulation resistance: 100 Mø min.
No damage, cracks or parts dislocation.
Contact resistance: 40 mø max. (change from initial value)
No deformation of components affecting performance.
BT Push-Push (ejection mechanism), Bottom board mounting (Reverse)
CS Hinge, Push-Pull (no ejection mechanism), Top board mounting (Standard)
D Push-Pull (no ejection mechanism), Top board mounting (Standard)
Stainless steel
Stainless steel
Copper alloy
Piano wire
Stainless steel
Copper alloy
Copper alloy
Specification
Material
Material
Operating temperature range: -25ç to +85ç (Note 1)
Storage temperature range : -40ç to +85ç (Note 2)
LCP
LCP
DM3 AT – SF – PEJM5
(DM3AT, DM3BT)
1
(DM3AT)
(DM3BT)
(DM3BT)
2
3
Contact area: Gold plated
Contact area: Gold plated
Lead area: Gold plated
Lead area: Gold plated
Lead area: Gold plated
Measure at 500 V DC
500 V AC / 1 minute
1mA
Frequency: 10 to 55 Hz, single amplitude of 0.75 mm,
3 directions for 2 hours
96 hours at of 40 ± 2ç, and humidity of 90 to 95%
-55ç ➝ 5 to 35ç ➝85ç ➝ 5 to 35ç
Times: 30 min. ➝ 5 min. ➝ 30 min. ➝ 5 min.
5 cycles
10,000 cycles, 400 to 600 cycles per hour (DM3AT, DM3B)
5,000 cycles, 400 to 600 cycles per hour (DM3C, DM3D)
Reflow
Manual soldering : 350ç for 3 seconds
Nickel plated
Color: Black
Color: Black
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Tin plated
3
4
Finish
Finish
Termination type : SF Right-angle SMT(Standard)
Card ejection code : PEJM5, PEJS
None
Operating humidity range: RH 95% max.
(No condensation)
4
: At the recommended temperature profile
Conditions
DSF Right-angle SMT(Reverse)
: Manual card
(Push insert/push eject)
insertion/ejection
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Remarks
Remarks
UL94V-0
UL94V-0