C200H-OC221 Omron, C200H-OC221 Datasheet - Page 42

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C200H-OC221

Manufacturer Part Number
C200H-OC221
Description
I/O Module
Manufacturer
Omron
Datasheets

Specifications of C200H-OC221

Leaded Process Compatible
No
Peak Reflow Compatible (260 C)
No
No. Of Outputs
8
No. Of Digital Outputs
8
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
28
Memory Packs
4. On the printed circuit board there is a socket for the EPROM Chip. On the
5. Reassemble the EPROM Pack in the reverse order of disassembly. During
socket you will find a notch. Align the notch on the socket with the notch on
the EPROM Chip and mount the EPROM Chip to the socket as shown be-
low.
reassembly, ensure that the circuit board is inserted along the guides on the
top and bottom of the Pack housing and that the projections on the housing
fit into the holes in the holding bracket. Be sure to lock the holding bracket
into the right side of the housing. When reassembled, the Pack should ap-
pear as shown below.
Circuit board guide
Notch
Circuit board guide
Bracket
Hole
Holding bracket
Circuit board
Section
3-2

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