45593-1600 Molex Inc, 45593-1600 Datasheet - Page 6

CONN PLUG 16POS .8MM VERT PCB

45593-1600

Manufacturer Part Number
45593-1600
Description
CONN PLUG 16POS .8MM VERT PCB
Manufacturer
Molex Inc
Series
HandyLink™ 45593r
Datasheets

Specifications of 45593-1600

Connector Style
Plug
Connector Type
Handylink
Number Of Positions
16
Mounting Type
Through Hole
Termination
Solder
Contact Finish
Gold
Color
Black
Housing Material
Thermoplastic, High Temperature
Insulation Resistance
1000 M Ohms
Mounting Angle
Vertical
Operating Temperature Range
- 40 C to + 85 C
Number Of Positions / Contacts
16
Pitch
0.8 mm
Contact Plating
Gold, Tin
Contact Material
High Performance Alloy (HPA)
Gender
Male
Current Rating
1.5 A
Mounting Style
Through Hole
Termination Style
Solder
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Contact Finish Thickness
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
045593-1600
045593-1600-E
0455931600
0455931600-E
45593-1600-E
455931600
455931600-E
WM17126

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
45593-1600
Quantity:
298
REVISION:
DOCUMENT NUMBER:
5.0 SOLDERING PROCESS RECOMMENDATIONS
A
5.1
5.1.1 PCB Layout
See the applicable Sales Drawing for an illustration of the recommended PCB layout.
Contact Molex if further assistance is required.
5.1.2 Solder Paste Stencil Layout
See Sales Drawing for solderable surfaces. Contact Molex if further assistance is required.
5.1.3 Reflow Profile
While the production solder reflow profile is typically established by the customer, based on their
specific application, generic reflow profiles can be found in Product Specification PS-44828-001.
The profiles are provided for reference purposes only.
5.1.4 Inspection
Solder joints should be inspected using established conventional methods.
5.2
5.2.1 PCB Layout
See the applicable Sales Drawings for illustrations of the recommended PCB pad layouts.
Contact Molex if further assistance is required.
5.2.2 Solder Paste Stencil Layout
See Sales Drawing for recommended PCB pad layout and solder paste thickness.
5.2.3 Reflow Profile
While the production solder reflow profile is typically established by the customer, based on their
specific application, generic reflow profiles can be found
The profiles are provided for reference purposes only.
5.2.4 Inspection
Solder joints should be inspected using established conventional methods.
AS-44828-001
ECR/ECN INFORMATION:
EC No:
DATE:
44828 SMT Receptacle Connector
45560 SMT Cradle Connector
6/24/04
UCP2004-2588
APPLICATION SPECIFICATION
PRELIMINARY HANDYLINK™
TITLE:
CREATED / REVISED BY:
T. Gregori/ M. Simmel
HANDYLINK™I/O CONNECTOR SYSTEM
APPLICATION SPECIFICATION
in
Product Specification PS-44828-001.
Marc Simmel
CHECKED BY:
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
APPROVED BY:
Joe Comerci
SHEET No.
6
of
21

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