TFBS4650 Vishay, TFBS4650 Datasheet - Page 8

• Manufacturer Part Number: TFBS4650
• Description: TRANSCEIVER, IRDA
• Manufacturer: Vishay

Specifications of TFBS4650

• Data Rate Max: 115.2Kbps
• Data Transmission Distance: 30cm
• Peak Wavelength: 886nm
• Supply Current: 2mA
• Supply Voltage Range: 2.4V To 3.6V
• Operating Temperature Range: -25°C To +85°C
• Msl: MSL 4 - 72 Hours
• External: RoHS Compliant
• External Depth: 1.6mm
• Rohs Compliant: Yes
• Communication Cone: 15°
• Svhc: No SVHC (20-Jun-2011)

Recommended Solder Profiles
Solder Profile for Sn/Pb soldering
Lead (Pb)-Free, Recommended Solder Profile
The TFBS4650 is a lead (Pb)-free transceiver and
qualified for lead (Pb)-free processing. For lead
(Pb)-free solder paste like Sn(3.0-4.0)Ag(0.5-0.9)Cu,
there are two standard reflow profiles: Ramp-Soak-
Spike (RSS) and Ramp-To-Spike (RTS). The Ramp-
Soak-Spike profile was developed primarily for reflow
ovens heated by infrared radiation. With widespread
use of forced convection reflow ovens the Ramp-To-
Spike profile is used increasingly. Shown below in fig-
ure 3 is VISHAY's recommended profiles for use with
the TFBS4650 transceivers. For more details please
refer to Application note: SMD Assembly Instruction.
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
Document Number 84672
Rev. 1.1, 03-Jul-06
260
240
220
200
180
160
140
120
100
Figure 2. Recommended Solder Profile for Sn/Pb soldering
80
60
40
20
0
0
2...4 °C/s
50
100
160 °C max.
120 s...180 s
240 °C max.
150
Time/s
200
2...4 °C/s
10 s max. at 230 °C
250
90 s max.
300
19431
350
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be rec-
ommended because the risk of damage is highly
dependent on the experience of the operator. Never-
theless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equiva-
lent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
19261
280
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
2 °C...4 °C/s
Figure 3. Solder Profile, RSS Recommendation
50
T ≥ 255 °C for 20 s max
T ≥ 217 °C for 50 s max
100
90 s...120 s
Vishay Semiconductors
150
Time/s
200
50 s max.
20 s
TFBS4650
T peak = 260 °C max.
250
www.vishay.com
2 °C...4 °C/s
300
127
350