HLMP-QM00-S0000 Avago Technologies US Inc., HLMP-QM00-S0000 Datasheet

HLMP-QM00-S0000

Manufacturer Part Number

HLMP-QM00-S0000

Description

LED, GREEN, 110mW, 690MCD

Manufacturer

Avago Technologies US Inc.

Datasheets

1.HLMP-QB00-S0000.pdf (3 pages)

2.HLMP-QM00-S0000.pdf (7 pages)

Specifications of HLMP-QM00-S0000

Led Color

Green

Luminous Intensity @ Test

690mcd

Wavelength Typ

525nm

Forward Current @ Test

20mA

Forward Current If Max

30mA

Forward Voltage @ Test

3.7V

Power Dissipation Pd

110mW

Viewing Angle

12Â°

Color

Green

Millicandela Rating

690mcd

Current - Test

20mA

Wavelength - Dominant

525nm

Wavelength - Peak

523nm

Voltage - Forward (vf) Typ

3.7V

Lens Type

Clear

Lens Style/size

Round, 1.78mm

Package / Case

Axial, Flat Leads

Size / Dimension

2.09mm L x 2.21mm W

Height

2.92mm

Mounting Type

Through Hole

Resistance Tolerance

525nm

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Luminous Flux @ Current - Test

Lead Free Status / RoHS Status

Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

HLMP-QM00-S0000

Manufacturer:

AVAGO

Quantity:

40 000

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

HLMP-QM00-S0000

Manufacturer:

AVAGO

Quantity:

50 000

Current page: 1 of 3
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HLMP-PB00-N0000 / HLMP-PM00-N0000

HLMP-QB00-S0000 / HLMP-QM00-S0000

High Power InGaN Subminiature Lamps

Reliability Data Sheet

Description

The following cumulative test results have been

obtained from testing performed at Avago

Technologies in accordance with the latest revision of

MIL-STD-883.

Avago Technologies tests parts at the absolute

maximum rated conditions recommended for the

device. The actual performance you obtain from Avago

Technologies parts depends on the electrical and

environmental characteristics of your application but

will probably be better than the performance outlined

in Table 1.

Table 1. Life Tests

Demonstrated Performance

Dome (Blue)

Dome (Green)

Colors

Stress Test

Conditions

= 30 mA

= 55°C

Hrs.

56,000

Total Device

Units

Tested

Failure Rate Prediction

The failure rate of semiconductor devices is determined

by the junction temperature of the device. The

relationship between ambient temperature and actual

junction temperature is given by the following:

where

watt

The estimated MTBF and failure rate at temperatures

lower than the actual stress temperature can be

determined by using an Arrhenius model for

temperature acceleration. Results of such calculations

are shown in the table on the following page using an

activation energy of 0.43 eV (reference MIL-HDBK-217).

AVG

(°C) = T

= ambient temperature in °C

= thermal resistance of junction-to-ambient in °C/

= average power dissipated in watts

(°C) + θ

Units

Failed

AVG

Point Typical Performance

MTBF

56,000

Failure Rate

(%/1K Hours)

≤1.79

Related parts for HLMP-QM00-S0000

HLMP-QM00-S0000 Summary of contents

Page 1

... HLMP-PB00-N0000 / HLMP-PM00-N0000 HLMP-QB00-S0000 / HLMP-QM00-S0000 High Power InGaN Subminiature Lamps Reliability Data Sheet Description The following cumulative test results have been obtained from testing performed at Avago Technologies in accordance with the latest revision of MIL-STD-883. Avago Technologies tests parts at the absolute maximum rated conditions recommended for the device ...

Page 2

Table 2. Reliability Predictions (I F Demonstrated Performance Ambient Junction Temperature (°C) Temperature (°C) 85 109 Notes: 1. The point typical MTBF (which represents 60% confidence level) is ...

Page 3

Table 3. Environmental Tests Test Name Temperature Cycle Humidity Life Humidity Storage Life Low Temperature Life Low Temperature Storage LIfe Room Termperature Life For product information and a complete list of distributors, please go to our web site: Avago, Avago ...

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