HCPL-2531-500E Avago Technologies US Inc., HCPL-2531-500E Datasheet - Page 6

• Manufacturer Part Number: HCPL-2531-500E
• Description: OPTOCOUPLER, TRANSISTOR, 5000VRMS
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-2531-500E

• No. Of Channels: 2
• Optocoupler Output Type: Phototransistor
• Input Current: 16mA
• Output Voltage: 20V
• Opto Case Style: SMD
• No. Of Pins: 8
• Ctr Max: 50%
• Isolation Voltage: 3.75kV
• Voltage - Isolation: 3750Vrms
• Number Of Channels: 2, Unidirectional
• Current - Output / Channel: 8mA
• Data Rate: 1MBd
• Propagation Delay High - Low @ If: 200ns @ 16mA
• Current - Dc Forward (if): 25mA
• Input Type: DC
• Output Type: Open Collector
• Mounting Type: Surface Mount, Gull Wing
• Package / Case: 8-SMD Gull Wing
• Output Device: Transistor With Base
• Number Of Elements: 2
• Reverse Breakdown Voltage: 5V
• Forward Voltage: 1.7V
• Forward Current: 25mA
• Package Type: PDIP SMD
• Collector Current (dc) (max): 8mA
• Power Dissipation: 45mW
• Current Transfer Ratio: 50%
• Pin Count: 8
• Mounting: Surface Mount
• Operating Temp Range: -55C to 100C
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Solder Reflow Thermal Profile
Recommended Pb-Free IR Profile
Regulatory Information
The devices contained in this data sheet have been approved by the following organizations:
UL
Recognized under UL 1577, Component Recognition
Program, File E55361.
CSA
Approved under CSA Component Acceptance Notice #5,
File CA 88324.
6
TEMPERATURE
ROOM
T
T
smax
300
200
100
smin
25
T
T
0
p
L
0
NOTE: NON-HALIDE FLUX SHOULD BE USED.
217 °C
PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC.
REFLOW HEATING RATE 2.5 °C ± 0.5 °C/SEC.
160 °C
150 °C
140 °C
150 - 200 °C
t 25 °C to PEAK
60 to 180 SEC.
PREHEAT
3 °C/SEC. MAX.
t
s
50
RAMP-UP
* 260 +0/-5 °C
3 °C + 1 °C/–0.5 °C
150 °C, 90 + 30 SEC.
TIME
PREHEATING TIME
2.5 C ± 0.5 °C/SEC.
t
t
L
p
100
TIME (SECONDS)
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
15 SEC.
60 to 150 SEC.
RAMP-DOWN
6 °C/SEC. MAX.
245 °C
TEMP.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01.
(Option 060 only)
PEAK
150
SEC.
30
SEC.
30
NOTES:
THE TIME FROM 25 °C to PEAK
TEMPERATURE = 8 MINUTES MAX.
T
NOTE: NON-HALIDE FLUX SHOULD BE USED.
* RECOMMENDED PEAK TEMPERATURE FOR
smax
WIDEBODY 400mils PACKAGE IS 245 °C
50 SEC.
= 200 °C, T
SOLDERING
200 °C
TIME
200
PEAK
TEMP.
240 °C
smin
= 150 °C
TIGHT
TYPICAL
LOOSE
230 °C
TEMP.
PEAK
250