AMMC-6442-W10 Avago Technologies US Inc., AMMC-6442-W10 Datasheet - Page 7

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AMMC-6442-W10

Manufacturer Part Number
AMMC-6442-W10
Description
35-40GHz 1W Linear Power Amp
Manufacturer
Avago Technologies US Inc.
Type
Power Amplifierr
Datasheet

Specifications of AMMC-6442-W10

Function
Amplifier
Number Of Channels
1
Frequency (max)
40GHz
Output Power
30@40000MHzdBm
Power Supply Requirement
Single
Single Supply Voltage (max)
5.5V
Dual Supply Voltage (min)
Not RequiredV
Dual Supply Voltage (typ)
Not RequiredV
Dual Supply Voltage (max)
Not RequiredV
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Recommended
The chip should be attached directly to the ground plane
using electrically conductive epoxy (Note 1). For conduc-
tive epoxy, the amount should be just enough to provide
a thin fillet around the bottom perimeter of the die. The
ground plane should be free of any residue that may
jeopardize electrical or mechanical attachment. Caution
should be taken to not exceed the Absolute Maximum
Rating for assembly temperature and time.
Thermo-sonic wedge bonding is the preferred method
for wire attachment to the bond pads. To optimize perfor-
mance for this device, the RF connections should be kept
at approximately 9mils in length using 1mil gold bond
wire. The recommended wire bonding stage temperature
is 150±2˚C.
Figure 15. Die dimensions
7
2000
RF_IN
1000
0
Vd1
0
0
96
Assembly Techniques
GND
Vg1
260
300
550
GND
Vd2
580
800
Vg2
1075
Vg3
GND
1800
1800
Vd3
2070
2070
GND
The chip is 100Pm thick and should be handled with care.
This chip has exposed air bridges on the top surface.
Handle at the edges or with a custom collet, (do not pick
up die with vacuum on die center).
This MMIC is static sensitive and ESD handling precau-
tions should be taken.
For more detailed information, see Avago Application
Note 54 “GaAs MMIC ESD, Die Attach and Bonding Guide-
lines. ”
Notes:
1. Sumitomo 1295SA silver epoxy is recommended.
2. Eutectic attach is not recommended any may jeopardize reliability of
the device
Vd3
2650
2650
RF_OUT
2000
1000
0

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