AMMP-6408-TR2G Avago Technologies US Inc., AMMP-6408-TR2G Datasheet - Page 2
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AMMP-6408-TR2G
Manufacturer Part Number
AMMP-6408-TR2G
Description
Power Amp, MMIC, 6-18GHz Pkg
Manufacturer
Avago Technologies US Inc.
Specifications of AMMP-6408-TR2G
Current - Supply
650mA
Frequency
6GHz ~ 18GHz
Gain
18dB
P1db
28.5dBm
Package / Case
8-SMD
Rf Type
LMDS, MMDS
Test Frequency
8GHz
Voltage - Supply
6V
Manufacturer's Type
Power Amplifier
Number Of Channels
1
Supply Current
650@5VmA
Frequency (max)
18GHz
Operating Supply Voltage (max)
6V
Package Type
SMT
Mounting
Surface Mount
Pin Count
8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Noise Figure
-
Lead Free Status / Rohs Status
Compliant
Absolute Maximum Ratings
Notes:
1. Operation in excess of any one of these conditions may result in permanent damage to this device. Functional operation at or near these
2. Dissipated power PD is in any combination of DC voltage, Drain Current, input power and power delivered to the load.
3. When operated at maximum PD with a base plate temperature of 85 qC, the median time to failure (MTTF) is significantly reduced.
4. These ratings apply to each individual FET. The operating channel temperature will directly affect the device MTTF. For maximum life, it is
DC Specifications/Physical Properties
Notes:
6. Assume SnPb soldering to an evaluation RF board at 80°C base plate temperatures. Worst case for the channel temperature is under the
Thermal Properties
2
Symbols
Vd-Vg
Vd
Vg
Id
PD
Pin
Tch
Tstg
Tmax
Symbol
I
V
R
T
Parameter
Maximum Power Dissipation
Thermal Resistance (Tjc)
Thermal Resistance (Tjc)
Under RF Drive
d
ch
Tjc
g
limitations will significantly reduce the lifetime of the device.
recommended that junction temperatures (Tj) be maintained at the lowest possible levels. See MTTF vs. Tchannel Temperature Table.
quiescent operation. At saturated output power, DC power consumption rises to 4.26 W with 1.14 W RF power delivered to load. Power
dissipation is 3.11 W and the temperature rise in the channel is 68.4°C. In this condition, the base plate temperature must be remained below
86.6°C to maintain maximum operating channel temperature below 155°C.
Parameters
Drain to Gate Voltage
Positive Supply Voltage
Gate Supply Voltage
Drain Current
Power Dissipation
CW Input Power
Operating Channel Temp
Storage Case Temp.
Maximum Assembly Temp (30 sec max)
Parameters and Test Conditions
Drain Supply Current (V
Gate Supply Operating Voltage (I
Thermal Resistance
Channel Temperature
[6]
Test Conditions
Tbaseplate = 85°C
Vd = 5V
Id = 650mA
PD = 3.25W
Tbaseplate = 75°C
Vd = 5V
Id = 892mA
Pout = 30dBm
Pd = 3.47W
Tbaseplate = 75°C
(Channel-to-Base Plate)
d
= 5 V, V
g
d(Q)
set for I
= 650 (mA))
Units
V
V
V
mA
W
dBm
qC
qC
qC
d
Typical)
Minimum
-2.5
Value
PD = 3.5W
Tchannel = 150°C
Tjc = 20°C/W
Tchannel = 140°C
Tjc = 20°C/W
Tchannel = 145°C
Units
mA
V
°C/W
°C
Maximum
8
5.5
0.5
TBD
3.5
20
+150
-65 to +155
+320
Value
650
-1.1
20
150.6
Notes
2
2 and 3
2
4