AMMP-6425-TR1G Avago Technologies US Inc., AMMP-6425-TR1G Datasheet
AMMP-6425-TR1G
Specifications of AMMP-6425-TR1G
Related parts for AMMP-6425-TR1G
AMMP-6425-TR1G Summary of contents
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... GHz 1W Power Amplifier in SMT Package Data Sheet Description The AMMP-6425 MMIC is a broadband 1W power amplifi surface mount package designed for use in transmitters that operate in various frequency bands between 18GHz and 28GHz. At 25GHz, it provides 31dBm of output power (P-1dB) and 25dB of small-signal gain from a small easy-to-use device. The device has input and output matching circuitry for use in 50Ω ...
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Absolute Maximum Ratings Symbols Parameters Vd-Vg Drain to Gate Voltage Vd Positive Supply Voltage Vg Gate Supply Voltage Id Drain Current PD Power Dissipation Pin CW Input Power Tch Operating Channel Temp Tstg Storage Case Temp. Tmax Maximum Assembly Temp ...
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... AMMP-6425 RF Specifications (Data obtained from 2.4-mm connector based test fixture, and this data is including connecter loss, and board loss 25° 5 =650 mA Symbol Parameters and Test Conditions Freq Operational Frequency [3, 4] Gain Small-signal Gain [3] P Output Power at 1dB ...
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... AMMP-6425 Typical Performance (Data obtained from 2.4-mm connector based test fixture, and this data is including connecter loss, and board loss 25°C, Vdd=5V, Idq=650mA Frequency [GHz] Figure 1. Typical Gain and Reverse Isolation Frequency[GHz] Figure 3. Typical P-1 and PAE Frequency [GHz] Figure 5. Typical IP3 (Third Order Intercept) @Pin=-20dBm 4 =-1 ...
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Pout[dBm] Figure 7. Typical Detector voltage vs. Output Power 0 S11_20 S11_-40 -5 S11_85 -10 -15 -20 - Frequency[GHz] Figure 9. Typical S11 over temperature 30 25 ...
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Typical Scattering Parameters (T = 25° 650 mA S11 S21 Freq [GHz] dB Mag Phase dB 1 -0.178 0.980 -37.820 -47.292 2 -0.523 0.942 -74.503 -44.008 3 -0.978 0.893 -110.430 ...
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... DC quiescent biasing condition at Vds=5V, Ids=650mA, Vgg=-1V, typical gate terminal current is approximately 0.3mA active biasing technique is selected for the AMMP6425 MMIC PA DC biasing, the active biasing circuit must have more than 10-times higher internal current that the gate terminal current. ...
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RF Input 8 7 − μ 100 pF Figure 13. Typical DC connection 20 |Icomp(I_METER.AMP1,0)| (mA) 18 Diode_current 5.5 6 6.5 Voltage (V) ...
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... Ground vias should be solder filled Figure 15b. PCB Land Pattern and Stencil Layouts The AMMP Packaged Devices are compatible with high volume surface mount PCB assembly processes. The PCB material and mounting pattern, as defined in the data sheet, optimizes RF performance and is strongly rec- ommended. An electronic drawing of the land pattern is available upon request from Avago Sales & ...
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... Figure 16. Suggested Lead-Free Reflow Profile for SnAgCu Solder Paste AMMP-6425 Part Number Ordering Information Devices Per Part Number Container AMMP-6425-BLKG 10 AMMP-6425-TR1G 100 AMMP-6425-TR2G 500 10 A properly designed solder screen or stencil is required to ensure optimum amount of solder paste is deposited onto the PCB pads. The recommended stencil layout is shown in Figure 15b ...
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... R 0.50 TYP. 1.75 ± 0.10 5.50 ± 0.05 Ø1.50 (MIN.) 8.00 ± 0. PITCH: WIDTH: Notes Pitches cumulative tolerance is ± 0.2 Mm. 3. Dimensions are in millimeters (mm). AMMP AMMP XXXX XXXX www.avagotech.com 0.114 (2.90) 0.018 (0.46) 0.014 (0.365 0.012 (0.30 0.028 (0.70) ...