HCNW3120#300 Avago Technologies US Inc., HCNW3120#300 Datasheet - Page 21

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HCNW3120#300

Manufacturer Part Number
HCNW3120#300
Description
TRANSISTOR-STAGE-OUTPUT OPTOCOUPLER,1-CHANNEL,1.4KV ISOLATION,SO
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of HCNW3120#300

Rohs Compliant
NO
Voltage - Isolation
5000Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
2.5A
Propagation Delay High - Low @ If
300ns @ 7mA ~ 16mA
Current - Dc Forward (if)
25mA
Input Type
DC
Output Type
Gate Driver
Mounting Type
Surface Mount, Gull Wing
Package / Case
8-SMD (400 mil) Gull Wing
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

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θ
LED Drive Circuit Considerations for Ultra High CMR Per-
formance. (Discussion applies to HCPL-3120, HCPL-J312,
and HCNW3120)
Without  a  detector  shield,  the  dominant  cause  of  op-
tocoupler  CMR  failure  is  capacitive  coupling  from  the 
input side of the optocoupler, through the package, to 
the detector IC as shown in Figure 29. The     HCPL-3120 
improves CMR perform-ance by using a detector IC with 
an optically transparent Faraday shield, which diverts the 
capacitively coupled current away from the sensitive IC 
circuitry. However, this shield does not eliminate the ca-
pacitive coupling between the LED and optocoupler pins 
5-8 as shown in Figure 30. This capacitive coupling causes 
Figure 28. Thermal model.
Figure 29. Optocoupler input to output capacitance model for unshielded
optocouplers.
21
LC
1
2
3
4
= 467 °C/W
C
C
LEDP
LEDN
HCPL-3120 fig 29
T
JE
θ
LD
= 442 °C/W
T
C
θ
CA
T
A
= 83 °C/W*
θ
T
DC
JD
= 126 °C/W
8
7
6
5
HCPL-3120 fig 28
  T
  T
  T
  q
  q
 q
  q
   *q
DC
LD
CA
JD
LC
JE
C
CA
  =  LED junction temperature 
  =  detector IC junction temperature 
  =  case temperature measured at the center of the package bottom 
  =  LED-to-case thermal resistance 
  =  LED-to-detector thermal resistance 
  =  detector-to-case thermal resistance 
  =  case-to-ambient thermal resistance 
θ
θ
θ
θ
T
T
T
LC
LD
DC
CA
CA
 will depend on the board design and the placement of the part.
JE
JD
C
= CASE TEMPERATURE MEASURED AT THE
= LED JUNCTION TEMPERATURE
= DETECTOR IC JUNCTION TEMPERATURE
= LED-TO-CASE THERMAL RESISTANCE
= LED-TO-DETECTOR THERMAL RESISTANCE
= DETECTOR-TO-CASE THERMAL RESISTANCE
= CASE-TO-AMBIENT THERMAL RESISTANCE
WILL DEPEND ON THE BOARD DESIGN AND
THE PLACEMENT OF THE PART.
CENTER OF THE PACKAGE BOTTOM
perturbations in the LED current during common mode 
transients and becomes the major source of CMR failures 
for a shielded optocoupler. The main design objective of 
a high CMR LED drive circuit becomes keeping the LED 
in  the  proper  state  (on  or  off )  during  common  mode 
transients.  For  example,  the  recommended  application 
circuit (Figure 25), can achieve 25 kV/µs CMR while mini-
mizing component complexity.
Techniques  to  keep  the  LED  in  the  proper  state  are 
discussed in the next two sections.
Figure 30. Optocoupler input to output capacitance model for shielded
optocouplers.
1
2
3
4
C
C
LEDP
LEDN
HCPL-3120 fig 30
C
SHIELD
LEDO1
C
LEDO2
8
7
6
5

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