MGA-655T6-BLKG Avago Technologies US Inc., MGA-655T6-BLKG Datasheet - Page 2

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MGA-655T6-BLKG

Manufacturer Part Number
MGA-655T6-BLKG
Description
IC,Microwave/Millimeter Wave Amplifier,SINGLE,GAAS,LLCC,6PIN,PLASTIC
Manufacturer
Avago Technologies US Inc.
Type
Low Noiser
Datasheets

Specifications of MGA-655T6-BLKG

Current - Supply
10mA
Frequency
2.5GHz ~ 4GHz
Gain
14.7dB
Noise Figure
1.17dB
P1db
12dBm
Package / Case
6-XFDFN Exposed Pad
Rf Type
General Purpose
Test Frequency
3.5GHz
Voltage - Supply
3V
Amplifier Type
MMIC
Bandwidth
2.5 to 4 GHz
Current, Input Bias
10 mA
Impedance, Thermal
75 °C/W
Power Dissipation
66 mW
Voltage, Supply
4 V
Manufacturer's Type
Low Noise Amplifier
Number Of Channels
1
Supply Current
14@3VmA
Frequency (max)
4GHz
Operating Supply Voltage (typ)
3V
Package Type
Ultra Thin profile
Mounting
Surface Mount
Pin Count
6
Noise Figure (typ)
1.2@3500MHzdB
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MGA-655T6-BLKG
Manufacturer:
Transcom
Quantity:
5 000
Part Number:
MGA-655T6-BLKG
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Absolute Maximum Rating
Process Capability for Gain
LSL=12.8, Nominal=14.7, USL=17
Note:
Distribution data sample size is 500 samples taken from 3 different wafers and 3 different lots. Future wafers allocated to this product may have
nominal values anywhere between the upper and lower limits.
2
Product Consistency Distribution Charts
Figure 1. Gain @ 3.5 GHz , V
Symbol
V
V
P
P
T
T
diss
j
STG
dd
bypass
in,max
Parameter
Device Voltage, RF Output to Ground
Control Voltage
CW RF Input Power
Total Power Dissipation
Junction Temperature
Storage Temperature
d
=3V, V
bypass
[1]
T
=2.7V
A
= 25°C
[3]
Process Capability for NF
Nominal=1.2, USL=1.6
Figure 2. NF @ 3.5 GHz , V
Units
V
V
dBm
mW
°C
°C
d
=3V, V
Absolute Max.
4
4
+14
66
150
-65 to 150
bypass
=2.7V
Thermal Resistance
(V
Notes:
1. Operation of this device in excess of any of
2. Thermal resistance measured using Infra-
3. For module substrate temperature, Tsub,
Process Capability for Ids
Nominal=10.1, USL=14
Figure 3. I
dd
these limits may cause permanent damage.
Red Measurement Technique.
>94°C derate the device power at 50
mW per °C rise in board (module belly)
temperature.
= 3.0 V, I
ds
@ 3.5 GHz , V
d
= 10 mA), Tjc = 75°C/W
[2,3]
d
=3V, V
bypass
=2.7V

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