MB2146-251 Fujitsu, MB2146-251 Datasheet - Page 5

• Manufacturer Part Number: MB2146-251
• Description: HEADER BOARD, QFP-100P, 8FX
• Manufacturer: Fujitsu
• Series: F2MC-8FXr

Specifications of MB2146-251

• Convert From: 100-QFP
• Convert To: Header Board
• Pitch Spacing: 0.65mm
• Row Pitch: 19.8mm
• Ic Adapter Type: QFP-100
• Mcu Supported Families: F2MC-8FX
• Mounting Type: SMD
• Supported: RoHS Compliant

2. Checking the Delivered Product
3. Handling Precautions
2
Before using the MB2146-251, confirm that the following components are included
in the box:
*1 : Referred to as “header board”. Header board is mounted on YQPACK100RB (Tokyo Eletech
*2 : IC socket manufactured by Tokyo Eletech Corporation, referred to as “NQPACK”, and sup-
*3 : IC socket cover manufactured by Tokyo Eletech Corporation, referred to as “HQPACK”, with
The header board is precision-manufactured to improve dimensional accuracy and to ensure reliable
contact. The header is therefore sensitive to mechanical shock. To ensure correct use of the header
in the proper environment, observe the following points regarding its insertion and removal:
• QFP-100P (0.65 mm pitch) Header board *
• Screws for securing Header board (M2 × 10 mm, 0.4 mm pitch)
• NQPACK100RB179 *
• HQPACK100RB179 *
• Operation manual (English version, this manual)
• To avoid placing stress on the NQPACK mounted on the user system board during connecting
Corporation) , referred to as “YQPACK”.
plied with a special screwdriver and 2 guide pins. A socket offering higher reliability,
NQPACK100RB179-SL (Tokyo Eletech Corporation, sold separately) , can be used by mak-
ing an IC socket mounting hole on the user system board. For more information, contact Tokyo
Eletech Corporation.
4 screws for securing HQPACK (M2 × 6 mm, 0.4 mm pitch) .
the header board.
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3
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: 1
: 4
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