DM3C-SF HRS (HIROSE), DM3C-SF Datasheet - Page 11

• Manufacturer Part Number: DM3C-SF
• Description: CONNECTOR, MICRO SD, HINGED
• Manufacturer: HRS (HIROSE)
• Series: DM3r

Specifications of DM3C-SF

• No. Of Contacts: 8
• Gender: Socket
• Contact Termination: Surface Mount Horizontal
• Contact Plating: Gold
• Contact Material: Copper Alloy
• Connector Mounting: RoHS Compliant
• Connector Type: Memory Card

All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
■Recommended temperature profile
■Precautions
1. Do not immerse or clean the entire connector with cleaning solutions as this may affect proper operation of the
2. Do not apply excessive force to the connector when handling or after installation on the PC board.
3. The connectors will reliably connect and operate with the correctly inserted microSD
4. The connector must be correctly mounted on the PC board before the card can be inserted. Do not insert the card in
5. Mounting on the Flexible Printed Circuit (FPC)
6. Small visible residual manufacturing fluids or tooling marks do not affect connector's performance.
7. Repeated insertions and removal of the cards may leave some marks on the card itself. This will have no affect on
● Refer to applicable Operation Manual listed below for additional precautions.
250
200
150
100
(ç)
ejection mechanism and electrical performance of the connector
the un-mounted connector.
the connector performance.
Follow the correct insertion / ejection procedure for the specific connector in use.
Attempts of incorrect insertion of the card may cause damage to the connector or the card.
To assure correct performance it is recommended that a flat reinforcement plate 0.3 mm min. thick be used under
the FPC.
50
DM3AT Series
DM3B Series
DM3C Series
DM3D Series
Series
150ç
90 to 120 seconds
Preheating
Time (Seconds)
230ç min.
200ç
Peak:250ç MAX
Operation Manual Number
Soldering
seconds
50
ETAD-F0345
ETAD-F0324
ETAD-F0335
ETAD-F0353
HRS test condition
Solder method
Environment
Solder composition :Paste, 96.5%Sn/3.0%Ag/0.5%Cu
Test board
Metal mask
The temperature profiles shown are based on the above
conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume / thickness and board
size / thickness. Consult your solder paste and equipment
manufacturer for specific recommendations.
:Reflow, IR/hot air
:Room air
:Glass epoxy 60mm∞100mm∞1.0mm thick
:0.12mm thick
(Senju Metal Industry, Co., Ltd.'s
Part Number:M705-GRN360-K2-V)
DM3 Series●microSD™ Card Connectors
TM
cards.
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