DM3C-SF HRS (HIROSE), DM3C-SF Datasheet - Page 2

• Manufacturer Part Number: DM3C-SF
• Description: CONNECTOR, MICRO SD, HINGED
• Manufacturer: HRS (HIROSE)
• Series: DM3r

Specifications of DM3C-SF

• No. Of Contacts: 8
• Gender: Socket
• Contact Termination: Surface Mount Horizontal
• Contact Plating: Gold
• Contact Material: Copper Alloy
• Connector Mounting: RoHS Compliant
• Connector Type: Memory Card

All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
2
DM3 Series●microSD™ Card Connectors
■Specifications(DM3 Series)
Note 1: Includes temperature rise caused by current flow.
Note 2. The term "storage" refers to products stored for long period prior to mounting and use.
■Materials and Finishes
DM3AT, DM3B
DM3C, DM3D
■Ordering information
1. Insulation resistance
2. Withstanding voltage
3. Contact resistance
4. Vibration
5. Humidity
6. Temperature cycle
7. Durability
8. Resistance to
soldering heat
1
2
Ratings
Series name: DM3
Connector type
Number of contacts : 8
Other components
Item
Guide cover
Guide cover
Insulator
Contacts
Insulator
Contacts
Part
Part
Current rating: 0.5A
Voltage rating: 125V AC
: AT Push-Push (ejection mechanism), Top board mounting (Standard)
1000 Mø min. (Initial value)
No flashover or insulation breakdown
100mø max. (Initial value)
No electrical discontinuity of 100 ns or longer
No damage, cracks or parts dislocation.
Contact resistance: 40 mø max. (change from initial value)
Insulation resistance: 100 Mø min.
No damage, cracks or parts dislocation.
Contact resistance: 40 mø max. (change from initial value)
Insulation resistance: 100 Mø min.
No damage, cracks or parts dislocation.
Contact resistance: 40 mø max. (change from initial value)
No deformation of components affecting performance.
B Push-Push (ejection mechanism), Bottom board mounting (Reverse)
C Hinge, Push-Pull (no ejection mechanism), Top board mounting (Standard)
D Push-Pull (no ejection mechanism), Top board mounting (Standard)
Stainless steel (DM3AT)
Copper alloy (DM3B)
Stainless steel
Stainless steel
Copper alloy
Copper alloy
Specification
Piano wire
Material
Material
Operating temperature range: -25ç to +85ç (Note 1)
Storage temperature range : -40ç to +85ç (Note 2)
LCP
LCP
DM3 AT – SF – PEJ
1
2
3
Contact area: Gold plated
Contact area: Gold plated
Lead area: Gold plated
Lead area: Gold plated
Lead area: Gold plated
Measure at 500 V DC
500 V AC / 1 minute
1mA
Frequency: 10 to 55 Hz, single amplitude of 0.75 mm,
3 directions for 2 hours
96 hours at of 40 ± 2ç, and humidity of 90 to 95%
-55ç ➝ 5 to 35ç ➝85ç ➝ 5 to 35ç
Times: 30 min. ➝ 5 min. ➝ 30 min. ➝ 5 min.
5 cycles
10,000 cycles, 400 to 600 cycles per hour (DM3AT, DM3B)
5,000 cycles, 400 to 600 cycles per hour (DM3C, DM3D)
Reflow
Manual soldering : 350ç for 3 seconds
Nickel plated
Color: Black
Color: Black
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Tin plated
3
4
Finish
Finish
4
Termination type : SF Right-angle SMT(Standard)
Card ejection code : PEJ
None
Operating humidity range: RH 95% max.
(No condensation)
: At the recommended temperature profile
Conditions
DSF Right-angle SMT(Reverse)
: Manual card
(Push insert/push eject)
insertion/ejection
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Remarks
Remarks
UL94V-0
UL94V-0