75005-0304 Molex Inc, 75005-0304 Datasheet - Page 3
![HS Mezz Rec Assy 4.5mm 6 Pr C-Peg](/photos/1/80/18067/75005-0304_sml.jpg)
75005-0304
Manufacturer Part Number
75005-0304
Description
HS Mezz Rec Assy 4.5mm 6 Pr C-Peg
Manufacturer
Molex Inc
Series
Plateau HS Mezz™ 75005r
Datasheets
1.75005-0306.pdf
(7 pages)
2.75005-0306.pdf
(9 pages)
3.75005-0306.pdf
(12 pages)
4.75005-0304.pdf
(3 pages)
Specifications of 75005-0304
Connector Type
Differential Pair Array, Female
Number Of Positions
12
Pitch
0.047" (1.20mm)
Number Of Rows
2
Mounting Type
Surface Mount
Features
Board Guide
Contact Finish
Gold
Contact Finish Thickness
30µin (0.76µm)
Mated Stacking Heights
10mm, 13mm, 15mm
Height Above Board
0.285" (7.24mm)
Product Type
Receptacles
Mounting Style
Wire
Mounting Angle
Vertical
Number Of Positions / Contacts
18
Housing Material
High Temperature Thermoplastic
Contact Material
High Performance Alloy (HPA)
Contact Plating
Gold
Voltage Rating
30 V
Current Rating
1.5 A
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
075005-0304
0750050304
750050304
SD-75005-001
WM17202TR
0750050304
750050304
SD-75005-001
WM17202TR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
75005-0304
Manufacturer:
Molex Connector Corporation
Quantity:
3 000
REVISION:
DOCUMENT NUMBER:
B
4.0 Testing Sequences
LLCR or Contact Resistance (5.2.1)
Dielectric Withstanding Voltage (5.2.2)
Durability (5.3.2)
Durability (preconditioning) (5.3.3)
Reseating (5.3.4)
Vibration (5.3.5)
Thermal Shock (5.4.1)
Temperature Life (5.4.2)
Temperature Life (preconditioning) (5.4.3)
Humidity - Temp. Cycling (5.4.4)
Thermal Disturbance (5.4.5)
Thermal Cycling (5.4.7)
Mixed Flowing Gas (FMG) (5.4.6)
Notes:
1) The sample size for sequences 1-3, and 5 consisted of 5 High Speed Mezzanine Assemblies and 12
2) The sample size for sequence 4, consisted of 10 High Speed Mezzanine Assemblies and 24
3) The sample size for sequence 4 also included 2 high speed test boards with assemblies that will be
4.1 Sample Preparation
4.2 EIA 364 Sequences
TS-75005-001
Individual Ground Assemblies. (75005-0006 and 75003-0008)
sent through the entire sequence. The boards will be checked for any change in the High Speed
performance of the connectors.
Individual Ground Assemblies. (75005-0006 and 75003-0008)
All samples were prepared and reflowed using the appropriate EIA standards and processing
specifications laid out in the High Speed Mezzanine Application Specification (AS-75005-001).
ECR/ECN INFORMATION:
EC No:
DATE:
Test or Examination
UCP2003-2204
2003 / 04 / 10
Sample Size
HIGH SPEED MEZZANINE
TITLE:
CREATED / REVISED BY:
TEST SUMMARY
Ken Stiles
BOARD TO BOARD CONNECTOR SYSTEM
1, 4, 6
5/12
2
5
3
1
TEST SUMMARY FOR THE
HIGH SPEED MEZZANINE
EIA-364-1000.01 Test Group Sequences
1, 4, 6, 8
5/12
2
2
7
3
5
CHECKED BY:
Ken Stiles
1, 4, 6
5/12
3
2
5
3
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
1, 4, 6, 8,10
10/24
4
2
9
3
7
5
Manny Banakis
APPROVED BY:
1, 4, 6, 8
5/12
5
2
7
3
5
SHEET No.
3
of
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