75005-0304 Molex Inc, 75005-0304 Datasheet - Page 8
![HS Mezz Rec Assy 4.5mm 6 Pr C-Peg](/photos/1/80/18067/75005-0304_sml.jpg)
75005-0304
Manufacturer Part Number
75005-0304
Description
HS Mezz Rec Assy 4.5mm 6 Pr C-Peg
Manufacturer
Molex Inc
Series
Plateau HS Mezz™ 75005r
Datasheets
1.75005-0306.pdf
(7 pages)
2.75005-0306.pdf
(9 pages)
3.75005-0306.pdf
(12 pages)
4.75005-0304.pdf
(3 pages)
Specifications of 75005-0304
Connector Type
Differential Pair Array, Female
Number Of Positions
12
Pitch
0.047" (1.20mm)
Number Of Rows
2
Mounting Type
Surface Mount
Features
Board Guide
Contact Finish
Gold
Contact Finish Thickness
30µin (0.76µm)
Mated Stacking Heights
10mm, 13mm, 15mm
Height Above Board
0.285" (7.24mm)
Product Type
Receptacles
Mounting Style
Wire
Mounting Angle
Vertical
Number Of Positions / Contacts
18
Housing Material
High Temperature Thermoplastic
Contact Material
High Performance Alloy (HPA)
Contact Plating
Gold
Voltage Rating
30 V
Current Rating
1.5 A
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
075005-0304
0750050304
750050304
SD-75005-001
WM17202TR
0750050304
750050304
SD-75005-001
WM17202TR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
75005-0304
Manufacturer:
Molex Connector Corporation
Quantity:
3 000
REVISION:
DOCUMENT NUMBER:
B
Soldered locating Pegs
EIA 364 Test Samples 80.07 N MIN
Unstressed 100% Fill
Unstressed 100% Fill
Unstressed 50% Fill
Soldered locating Pegs
EIA 364 Test Samples 53.37 N MIN
Stressed 100% Fill
Unstressed 100% Fill
Unstressed 100% Fill
Thermal Shock and Cyclic Humidity
Unstressed 50% Fill
TS-75005-001
Stressed 100% Fill
Treatment
Reworked
ECR/ECN INFORMATION:
EC No:
DATE:
Treatment
Reworked
UCP2003-2204
2003 / 04 / 10
Treatment
4/4/16
HIGH SPEED MEZZANINE
Requirement Board Thickness # of Pairs
53.38 N MIN
53.38 N MIN
53.38 N MIN
53.38 N MIN
53.38 N MIN
Requirement Board Thickness # of Pairs Max
35.58 N MIN
35.58 N MIN
35.58 N MIN
35.58 N MIN
35.58 N MIN
Sequence F - Plating Adhesion Test
TITLE:
CREATED / REVISED BY:
TEST SUMMARY
Sequence E - Side Load Force
Sequence E - Axial Force
Ken Stiles
BOARD TO BOARD CONNECTOR SYSTEM
No Flaking, Peeling, or other adhesion Failure Passed
1.83 mm
1.83 mm
1.57 mm
1.83 mm
1.83 mm
1.83 mm
1.83 mm
1.83 mm
1.57 mm
1.83 mm
1.83 mm
1.83 mm
TEST SUMMARY FOR THE
HIGH SPEED MEZZANINE
Requirement
CHECKED BY:
Ken Stiles
12
6
6
6
6
6
12
6
6
6
6
6
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
278.00 124.00 209.00
142.00 102.00 127.00
166.00 112.00 158.00
233.00 158.00 175.00
153.46
189.83 151.84 170.83
Max
85.40 72.80 77.20
54.60 44.90 50.20
55.70 41.70 49.10
64.00 50.50 57.00
58.27 40.03 48.73
75.44 71.43 73.44
82.29
Min
Min
Manny Banakis
APPROVED BY:
Result
Mean
108.89
Mean
SHEET No.
8
of
20