BLM18EG121SN1-D Murata, BLM18EG121SN1-D Datasheet - Page 143

• Manufacturer Part Number: BLM18EG121SN1-D
• Description: CHIP FERRITE BEAD, 0603, 2A
• Manufacturer: Murata
• Series: BLM18EGr

Specifications of BLM18EG121SN1-D

• Impedance: 120ohm
• Dc Resistance Max: 0.04ohm
• Dc Current Rating: 2A
• Ferrite Mounting: SMD
• Ferrite Case Style: 0603
• No. Of Pins: 2
• Frequency Range: 100MHz To 1GHz

NFp Chip EMIFILr
!Note
2. Solder Paste Printing and Adhesive Application
NFM
NFR
NFL
When reflow soldering the chip EMI suppression filter, the
printing must be conducted in accordance with the
following cream solder printing conditions.
If too much solder is applied, the chip will be prone to
damage by mechanical and thermal stress from the PCB
and may crack.
Standard land dimensions should be used for resist and
copper foil patterns.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
Series
NFM18C/18PC
NFL18ST
NFM3DC/3DP
NFM41C/41P
NFM18PS
oGuideline of solder paste thickness:
0.05
Soldering and Mounting
100-150 m: NFM18/21/3D/31P, NFR, NFL
150-200 m: NFM55P
100-200 m: NFM41
1.0
2.2
0.4
1.0
2.5
3.9
1.5
3.5
5.5
0.8
1.2
2.0
Solder Paste Printing
NFL18SP
NFM21C/21PC
NFR21G/NFL21S
NFM31P
NFM55P
1.0
2.0
1.5
4.7
6.7
0.4
1.4
0.6
2.6
4.4
1.0
2.5
When flow soldering the EMI suppression filter, apply the
adhesive in accordance with the following conditions.
If too much adhesive is applied, then it may overflow into
the land or termination areas and yield poor solderability.
In contrast, if insufficient adhesive is applied, or if the
adhesive is not sufficiently hardened, then the chip may
become detached during flow soldering process.
NFM3D/31P/41 Series
Apply 0.1mg for NFM41C/41 and 0.06mg for
NFM3D/NFM31P of bonding agent at each chip.
Do not cover electrodes.
Bonding agent
Adhesive Application
Continued on the following page.
Coating position of
bonding agent
(in mm)
141
Mar.28,2011
C31E.pdf