BLM18EG121SN1-D Murata, BLM18EG121SN1-D Datasheet - Page 197

• Manufacturer Part Number: BLM18EG121SN1-D
• Description: CHIP FERRITE BEAD, 0603, 2A
• Manufacturer: Murata
• Series: BLM18EGr

Specifications of BLM18EG121SN1-D

• Impedance: 120ohm
• Dc Resistance Max: 0.04ohm
• Dc Current Rating: 2A
• Ferrite Mounting: SMD
• Ferrite Case Style: 0603
• No. Of Pins: 2
• Frequency Range: 100MHz To 1GHz

!Note
Block Type EMIFILr
1. Cleaning
2. Soldering
3. Other
<Operating Environment>
Do not use products in a chemical atmosphere such as
chlorine gas, acid or sulfide gas.
Do not use products in the environment close to the
organic solvent.
<Storage and Handling Requirements>
1. Storage Period
2. Storage Conditions
Do not use products beyond the rated current and rated
voltage as this may create excessive heat and
deteriorate the insulation resistance.
(1) Storage temperature: -10 to +40˚C
(2) Do not store products in a chemical atmosphere
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
Storage and Operating Conditions
Do not clean BNX series (SMD Type).
Before cleaning, please contact Murata engineering.
Reliability decreases with improper soldering methods.
Please solder by the standard soldering conditions
shown in mounting information.
Noise suppression levels resulting from Murata's EMI
suppression filters EMIFILr may vary, depending on
the circuits and ICs used, type of noise, mounting
pattern, mounting location, and other operating
conditions. Be sure to check and confirm in advance
the noise suppression effect of each filter, in actual
circuits, etc. before applying the filter in a commercial-
purpose equipment design.
BNX series should be used within 12 months.
Solderability should be checked if this period is
exceeded.
Notice (Soldering and Mounting)
Rating
Relative humidity: 15 to 85%
Avoid sudden changes in temperature and humidity.
such as chlorine gas, acid or sulfide gas.
SMD Type
!Caution/Notice
!Caution
Notice
1. Resin Coating
2. Handling of a Substrate (for BNX02p)
Bending
Handling
Using resin for coating/molding products may affect
the products performance.
So please pay careful attention in selecting resin.
Prior to use, please make the reliability evaluation with
the product mounted in your application set.
After mounting products on a substrate, do not apply
any stress to the product caused by bending or
twisting to the substrate when cropping the substrate,
inserting and removing a connector from the substrate
or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in
the Product.
Twisting
195
Mar.28,2011
C31E.pdf