TFBS6711-TR3 Vishay, TFBS6711-TR3 Datasheet - Page 7

• Manufacturer Part Number: TFBS6711-TR3
• Description: Infrared Transceivers FIR 4Mbit/s 2.4-3.6V Op Voltage
• Manufacturer: Vishay

Specifications of TFBS6711-TR3

• Wavelength: 900 nm
• Continual Data Transmission: 4 Mbit/s
• Transmission Distance: 50 cm
• Radiant Intensity: 115 mW/sr
• Half Intensity Angle Degrees: 48 deg
• Pulse Width: 1.8 us
• Maximum Rise Time: 50 ns, 40 ns
• Maximum Fall Time: 50 ns, 40 ns
• Led Supply Voltage: - 0.5 V to 6.5 V
• Operating Voltage: 2.4 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 25 C
• Data Rate Max: 4Mbps
• Data Transmission Distance: 50cm
• Peak Wavelength: 900nm
• Supply Current: 1.9mA
• Supply Voltage Range: 2.4V To 3.6V
• Operating Temperature Range: -25°C To +85°C
• Power Dissipation Pd: 500mW
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

SETTING
MODE (2.4 kbit/s to 115.2 kbit/s)
1. Set SD input to logic “high”.
2. Set TXD input to logic “low”. Wait t
3. Set SD to logic “low” (this negative edge latches state of
4. TXD must be held for t
TXD is now enabled as normal TXD input for the lower
bandwidth mode.
RECOMMENDED SOLDER PROFILES
Solder Profile for Sn/Pb Soldering
Lead (Pb)-free, Recommended Solder Profile
The TFBS6711 is a lead (Pb)-free transceiver and qualified
for lead (Pb)-free processing. For lead (Pb)-free solder paste
like Sn
profiles: Ramp-Soak-Spike (RSS) and Ramp-To-Spike
(RTS). The Ramp-Soak-Spike profile was developed
primarily for reflow ovens heated by infrared radiation. With
widespread use of forced convection reflow ovens the
Ramp-To-Spike profile is used increasingly. Shown in
figure 5 and 6 are Vishay’s recommended profiles for use
with the TFBS6711 transceivers. For more details please
refer to the application note “SMD Assembly Instructions”.
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices wave
soldering is not recommended.
Document Number: 84676
Rev. 1.7, 17-Sep-09
TRUTH TABLE
19431
TXD, which determines speed setting).
260
240
220
200
180
160
140
120
100
80
60
40
20
Fig. 5 - Recommended Solder Profile for Sn/Pb Soldering
0
0
High
(3.0-4.0)
Low
Low
Low
Low
Low
SD
2 °C/s to 4 °C/s
50
Ag
TO THE
(0.5-0.9)
Low Profile Fast Infrared Transceiver (FIR, 4 Mbit/s)
100
High > 80 µs
Cu, there are two standard reflow
160 °C max.
240 °C max.
120 s to 180 s
[e-mail], [e-mail],
h
High
TXD
Low
Low
Low
150
≥ 200 ns.
x
For technical questions within your region, please contact one of the following:
Time (s)
LOWER BANDWIDTH
2 °C/s to 4 °C/s
200
INPUTS
s
≥ 200 ns.
for IrDA
10 s max. at 230 °C
250
90 s max.
< max. irradiance E
> max. irradiance E
> min. irradiance E
INPUT IRRADIANCE mW/m
300
®
Applications
350
< 4
x
x
x
e
e
e
in angular range
in angular range
in angular range
Manual Soldering
Manual soldering is the standard method for lab use.
However,
recommended because the risk of damage is highly
dependent on the experience of the operator. Nevertheless,
we added a chapter to the above mentioned application note,
describing manual soldering and desoldering.
Storage
The storage and drying processes for all Vishay transceivers
(TFDUxxxx and TFBSxxx) are equivalent to MSL4.
The data for the drying procedure is given on labels on the
packing and also in the application note “Taping, Labeling,
Storage and Packing”.
19261
280
260
240
220
200
180
160
140
120
100
2
80
60
40
20
0
0
2 °C...4 °C/s
SD
TXD
Fig. 6 - Solder Profile, RSS Recommendation
[e-mail]
Fig. 4 - Mode Switching Timing Diagram
for
50
Weakly pulled (500 kΩ) high
a
T ≥ 255 °C for 20 s max
T ≥ 217 °C for 50 s max
50 %
Low active (echo)
100
production
Low (active)
90 s...120 s
Vishay Semiconductors
RXD
High
High
t
s
x
150
50 %
Time/s
OUTPUTS
t
h
process
200
50 %
50 s max.
20 s
High: FIR
TFBS6711
Low: SIR
T peak = 260 °C max.
250
TRANSMITTER
it
www.vishay.com
14873
cannot
2 °C...4 °C/s
300
I
0
0
0
0
0
e
350
be
7