HSDL-3612-008 Avago Technologies US Inc., HSDL-3612-008 Datasheet - Page 17

• Manufacturer Part Number: HSDL-3612-008
• Description: Infrared Transceivers 1m 3V SIR 400units t op options
• Manufacturer: Avago Technologies US Inc.

Specifications of HSDL-3612-008

• Wavelength: 875 nm, 880 nm
• Continual Data Transmission: 115.2 Kbit/s
• Transmission Distance: 1.5 m
• Radiant Intensity: 120 mW/sr
• Half Intensity Angle Degrees: 30 deg
• Pulse Width: 1.6 us, 4 us
• Maximum Rise Time: 40 ns, 25 ns
• Maximum Fall Time: 40 ns, 25 ns
• Led Supply Voltage: - 0.5 V to 7 V
• Maximum Forward Current: 165 mA
• Operating Voltage: 2.7 V to 5.25 V
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: - 20 C
• Dimensions: 12.2 mm x 5.1 mm x 4 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

2.1 Recommended Metal Solder
Stencil Aperture
It is recommended that only
0.152 mm (0.006 inches) or
0.127 mm (0.005 inches) thick
stencil be used for solder paste
Figure 4.0. Solder paste stencil aperture.
3.0 Pick and Place Misalignment
Tolerance and Product Self-
Alignment after Solder Reflow
If the printed solder paste volume
is adequate, the unit will self-
align in the X-direction after
solder reflow. Units should be
properly reflowed in IR Hot Air
convection oven using the
recommended reflow profile. The
direction of board travel does not
matter.
17
See Fig 4.0
t, nominal stencil thickness
mm
0.152
0.127
l
Aperture opening for shield pad is 2.8 mm x 2.35 mm as per land dimensions
SOLDER
PASTE
w, the width of aperture is fixed at 0.70 mm (0.028 inches)
inches
0.006
0.005
printing. This is to ensure
adequate printed solder paste
volume and no shorting. The
following combination of metal
stencil aperture and metal stencil
thickness should be used:
Allowable Misalignment Tolerance
X – direction
Theta – direction
APERTURE AS PER
LAND DIMENSIONS
w
l, length of aperture
mm
2.8 0.05
3.4 0.05
t (STENCIL THICKNESS)
inches
0.110 0.002
0.134 0.002
2 degrees
0.2 mm (0.008 inches)