HSDL-3002-007 Avago Technologies US Inc., HSDL-3002-007 Datasheet - Page 13

• Manufacturer Part Number: HSDL-3002-007
• Description: Infrared Transceivers 50cm 3V SIR+RC
• Manufacturer: Avago Technologies US Inc.

Specifications of HSDL-3002-007

• Wavelength: 875 nm
• Continual Data Transmission: 115.2 Kbit/s
• Transmission Distance: 50 cm
• Radiant Intensity: 40 mW/sr
• Half Intensity Angle Degrees: 30 deg to 60 deg
• Pulse Width: 1.6 us, 7.5 us
• Maximum Rise Time: 100 ns, 600 ns
• Maximum Fall Time: 100 ns, 600 ns
• Led Supply Voltage: 0 V to 7 V
• Operating Voltage: 2.7 V to 5.5 V
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: - 20 C
• Dimensions: 9.1 mm x 3.65 mm x 2.7 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

13
1.2 Recommended Metal Solder
Stencil Aperture
It is recommended that only a
0.152 mm (0.006 inches) or a
0.127 mm (0.005 inches) thick
stencil be used for solder paste
printing. This is to ensure
adequate printed solder paste
volume and no shorting. See the
table below the drawing for
combinations of metal stencil
aperture and metal stencil
thickness that should be used.
Aperture opening for shield pad
is 3.05 mm x 1.1 mm as per land
pattern.
1.3 Adjacent Land Keepout and
Solder Mask Areas
Adjacent land keep-out is the
maximum space occupied by
the unit relative to the land
pattern. There should be no other
SMD components within this
area.
The minimum solder resist strip
width required to avoid solder
bridging adjacent pads is
0.2 mm.
It is recommended that two
fiducial crosses be placed at mid-
length of the pads for unit
alignment.
Note: Wet/Liquid Photo-
Imageable solder resist/mask is
recommended.
Figure 18. Solder stencil aperture.
Figure 19. Adjacent land keepout and solder mask areas.
Stencil thickness, t (mm)
0.152 mm
0.127 mm
l
APERTURES AS PER
LAND DIMENSIONS
SOLDER MASK
0.2
10.1
Aperture size(mm)
length, l
2.60
3.00
UNITS: mm
0.05
0.05
w
width, w
0.55
0.55
3.85
3.2
0.05
0.05
t