1954381-1 TE Connectivity, 1954381-1 Datasheet - Page 4

• Manufacturer Part Number: 1954381-1
• Description: GROUNDING CLIP, 12-10 AWG GROUND WIRE
• Manufacturer: TE Connectivity
• Type: Grounding Clipr
• Series: SOLARLOKr

Specifications of 1954381-1

• Product Length (mm): 20mm
• Product Depth (mm): 32.5mm
• Product Height (mm): 24.5mm
• Accessory Type: Grounding Clip
• Rohs Compliant: Yes
• Product Type: Accessory
• Screw Size: 10-32 Thread Cutting
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C, Reflow solder capable to 260°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Lead Free Status / RoHS Status: Compliant
• For Use With: 12-10 AWG Solid Un-Insulated Ground Wire
• Lead Free Status / Rohs Status: RoHS Compliant part

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tycoelectronics.com/solar
Catalog 3-1773458-7 | Issue Date 09/2010
SOLARLOK Connectivity Systems for PV Manufacturers
Mechanical, Environmental and Electrical Testing Capabilities
Dimensions are in inches and millimeters unless otherwise specified.
Values in brackets are standard equivalents. Dimensions are shown
for reference purposes only. Specifications subject to change.
Force-deflection curves are generated to verify that
spring contact properties meet design criteria.
Contact resistance and temperature rise are measured
and recorded automatically. These parameters help to
establish/verify current carrying capacity, and de-rating
curves. Test samples are isolated to minimize the
influence of external variables such as air movement.
Components/assemblies are exposed to cold, heat,
moisture, and temperature change. Thermal shock
is accomplished with the 2-chamber method.
Environmental chambers operate from -70°C to +180°C
enabling simulation of real-world conditions.
Slow-motion bending and vibration testing simulates
line movements in the wire, stressing the crimped
termination. Industrial atmospheres are generated
with a gas mixture of SO2, H2S, NO2 and Cl2.
3D X-ray computer tomography provides high
resolution three-dimensional non-destructive
analysis capability.
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