4-103325-0 TE Connectivity, 4-103325-0 Datasheet - Page 84

• Manufacturer Part Number: 4-103325-0
• Description: 40 MODII HDR SRRA B/A .100CL
• Manufacturer: TE Connectivity
• Type: Unshrouded Headerr
• Series: AMPMODU MOD II Seriesr

Specifications of 4-103325-0

• Pitch (mm): 2.54mm
• Gender: HDR
• Number Of Contacts: 40POS
• Number Of Contact Rows: 1
• Mounting Style: Through Hole
• Body Orientation: Right Angle
• Contact Plating: Gold Over Nickel
• Operating Temp Range: -65C to 105C
• Termination Method: Solder
• Current Rating (max): 3/ContactA
• Contact Material: Phosphor Bronze
• Housing Material: Thermoplastic
• Housing Color: Black
• Product Height (mm): 3.5mm
• Product Length (mm): 101.19mm
• Product Depth (mm): 9.39mm
• Rohs Compliant: NO
• Product Type: Headers - Breakaway
• Pitch: 2.54 mm
• Number Of Positions / Contacts: 40
• Number Of Rows: 1
• Row Spacing: 2.54 mm
• Mounting Angle: Right
• Termination Style: Solder
• Current Rating: 3 A
• Operating Temperature Range: - 65 C to + 105 C
• Mount Angle: Right Angle
• Pcb Mount Retention: Without
• Surface Mount Compatible: No
• Board Standoff: Without
• Mounting Ears: Without
• Mating Connector Lock: Without
• Post Size (mm [in]): 0.64 [.025]
• Mating Post Length (mm [in]): 5.84 [0.230]
• Panel Mount Retention: Without
• Current Rating (a): 3
• Insulation Resistance (m?): 5,000
• Dielectric Withstanding Voltage (v): 750
• Termination Post Length (mm [in]): 3.05 [0.120]
• Solder Tail Contact Plating: Tin-Lead over Nickel
• Header Type: Breakaway
• Number Of Positions: 40
• Centerline (mm [in]): 2.54 [0.100]
• Row-to-row Spacing (mm [in]): 2.54 [0.100]
• Selectively Loaded: No
• Mount Type: Printed Circuit Board
• Contact Plating, Mating Area, Material: Gold (15)
• Contact Shape: Square
• Contact Base Material: Phosphor Bronze
• Ul Flammability Rating: UL 94V-0
• Rohs/elv Compliance: ELV compliant, 5 of 6 Compliant
• Lead Free Solder Processes: Wave solder capable to 240°C
• Approved Standards: UL E28476, CSA LR7189
• Operating Temperature (°c): -65 – +105
• High Temperature Housing: No
• High Speed Serial Data Connector: No
• Lead Free Status / RoHS Status: Not Compliant

The Reliable Plated-Through Hole Interconnect
Solderless interconnections have been popular in electrical
and electronic applications with world-wide success for
decades. They provide reliable electrical and mechanical
stability and offer applied-cost savings across the board.
For PC board applications, AMP compliant ACTION PIN
posts provide these features:
Since AMP compliant ACTION PIN posts do not have to be
soldered, problems associated with solder are eliminated,
such as:
Solderless press-fit interconnections using AMP compliant
pins are primarily integrated in, but not limited to, backplanes.
Solderless press-fit interconnections are used in racks,
especially where connectors must be fixed on the solder
side of the PC board and/or component side. In these
applications, the holes for AMP A C T I O N PIN post connectors
are covered during the soldering process and press-fitting
is performed after soldering.
Other applications for AMP ACTION PIN post
interconnections include PC boards that incorporate
components using surface mount technology (SMT). Here,
too, press-fit interconnections can be applied after
soldering, thus eliminating complications associated with
connectors suitable for surface mounting.
Catalog 1307819
Revised 6-04
www.tycoelectronics.com
Large gas-tight contact zone
High reliability due to stored energy
More resistant to damage to plated-through holes during
installation
Especially suited for multilayer PC boards
Less costly board manufacturing due to larger hole
tolerances compared to use of solid pins
Application can be made by end-user
Repairability—contact can be replaced in the same pin
location (two repairs)
Installation with no heat cycling of board
Permits mass insertion by minimizing forces needed to
insert pins as compared to solid pin press-fit application
Significant applied-cost savings in many applications
Faulty solder joints
Solder fumes; contaminants are deposited on the
contacts
Solder spots; short circuits between printed circuits
Flux residuals
Thermal strain on printed circuit boards and
components
Degasing of plated-through holes
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
AMPMODU Interconnection System
AMP ACTION PIN Press-Fit Posts
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
Principle of the AMP Compliant ACTION PIN Post
When an AMP compliant ACTION PIN post is inserted
into a plated-through hole, two spring members are
compressed, exerting force against the hole for a gas-tight
connection. The diameter of the hole is smaller than the
diagonal size of the pin (see cross-section illustration below).
The beam characteristics of the pin are designed so that a
plastic, as well as an elastic, deformation takes place during
insertion. The two spring members compress to different
degrees to accommodate hole tolerances. The compliant
pin also reduces strain on the board. With a rigid pin, the
elastic strain energy is stored entirely in the board, leading
to damage of the plated-through holes. With the AMP
compliant ACTION PIN post, the residual force of the
elastic deformation maintains stored energy to produce a
tight contact zone between the pin and the plated-through
hole. This maintains long-term electrical and mechanical
reliability of the interconnection.
Cross-Section Area of AMPACTIONPIN Press-Fit Post in Printed
Circuit Board Holes
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
.037 [0.94]
Minimum
Hole Dia.
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967
.043 [1.09]
Maximum
Hole Dia.
167
5