BLM41PG102SH1L Murata, BLM41PG102SH1L Datasheet - Page 185

• Manufacturer Part Number: BLM41PG102SH1L
• Manufacturer: Murata

Specifications of BLM41PG102SH1L

• Mounting Style: Surface Mount
• Termination: Flat Style
• Operating Temp Range: -55C to 125C
• Product Height (mm): 1.6mm
• Product Depth (mm): 1.6mm
• Product Length (mm): 4.5mm
• Lead Free Status / RoHS Status: Compliant

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
NFW31S
NFE31P
NFE61P
NFA
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Series
oUse Sn/Pb=60/40 or Sn-3.0Ag-0.5Cu solder for
oCoat with solder paste to the following thickness:
oUse Sn/Pb=60/40 or Sn-3.0Ag-0.5Cu solder for
oCoat with solder paste to the following thickness:
oUse Sn/Pb=60/40 or Sn-3.0Ag-0.5Cu solder for
oCoat with solder paste to the following thickness:
pattern printing.
150-200 m
pattern printing.
150-200 m
pattern printing.
100-200 m: NFA31G/31C
100-150 m: NFA18S/21S
0.3
0.175
NFA31G/31C
0.05
2.6
NFA18S
1.375
0.4
1.3
2.0
Solder Paste Printing
0.8 pitch
0.6
0.225
0.6
2.2
4.2
1.5
4.8
8.8
0.25
0.5
1.5
0.25
NFA21S
0.5
EMIFILr (Soldering and Mounting)
NFW31S Series
Apply 0.2mg of bonding agent at each chip.
Apply 1.0mg of bonding agent at each chip.
Bonding agent
Bonding agent
Adhesive Application
Continued on the following page.
Bonding agent
1.5
4.8
9.0
Coating positon of
bonding agent
(in mm)
183
C31E.pdf
08.9.1
6