EMIF06-HMC01F2 STMicroelectronics, EMIF06-HMC01F2 Datasheet

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EMIF06-HMC01F2

Manufacturer Part Number
EMIF06-HMC01F2
Description
Manufacturer
STMicroelectronics
Type
6 Line EMI Filterr
Datasheet

Specifications of EMIF06-HMC01F2

Mounting Style
Surface Mount
Termination
Flat Style
Operating Temp Range
-40C to 85C
Product Height (mm)
0.65mm
Product Depth (mm)
1.92mm
Product Length (mm)
1.92mm
Lead Free Status / RoHS Status
Compliant

Available stocks

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Manufacturer
Quantity
Price
Part Number:
EMIF06-HMC01F2
Manufacturer:
ST
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Part Number:
EMIF06-HMC01F2LU
Manufacturer:
ST
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Features
Complies with the following standards
Applications
Description
The EMIF06-HMC01F2 is a highly integrated
array designed to suppress EMI / RFI noise for
high speed MultiMediaCard port filtering. The
EMIF06-HMC01F2 Flip Chip packaging means
the package size is equal to the die size.
Additionally, this filter includes ESD protection
circuitry which prevents damage to the application
when subjected to ESD surges up to 15 kV.
April 2008
6-line low-pass-filter
High efficiency in EMI filtering
Very low PCB space occupation: < 4.4 mm
Lead-free package
Very thin package: 0.65 mm
High efficiency in ESD suppression
High reliability offered by monolithic integration
High reducing of parasitic elements through
integration and wafer level packaging
IEC 61000-4-2 level 4 on external pins
– 15 kV (air discharge)
– 8 kV (contact discharge)
MIL STD 883E - Method 3015-6 Class 3
High speed MultiMediaCard
6-line IPAD™, EMI filter including ESD protection
2
Rev 2
Figure 1.
Figure 2.
TM: IPAD is a trademark of STMicroelectronics.
MMCcmd
MMCdat0
MMCdat2
MMCdat3
MMCdat1
MMCclk
Vmmc
A1 cmd
A2 clk
A3 Vmmc/Vdd
A4 MMCclk
B1 dat1
B2 dat0
B3 gnd
B4 MMCcmd
EMIF06-HMC01F2
Pin layout (bump side)
Basic cell configuration
R10
R11
R12
R13
R14
4
(16 bumps)
Flip Chip
3
2
C1 dat2
C2 gnd
C3 MMCdat1
C4 MMCdat0
D1 dat3
D2 gnd
D3 MMCdat3
D4 MMCdat2
GND
R2
R3
R4
R5
R6
R7
1
A
B
C
D
www.st.com
Vmmc
clk
cmd
dat0
dat1
dat2
dat3
1/8
8

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EMIF06-HMC01F2 Summary of contents

Page 1

... MIL STD 883E - Method 3015-6 Class 3 Applications ■ High speed MultiMediaCard Description The EMIF06-HMC01F2 is a highly integrated array designed to suppress EMI / RFI noise for high speed MultiMediaCard port filtering. The EMIF06-HMC01F2 Flip Chip packaging means the package size is equal to the die size. ...

Page 2

... Symbol line µ 200 µ °C) amb Parameter and test conditions = 25 °C) amb Parameters RM Test conditions Tolernace ± ± ± EMIF06-HMC01F2 Value 125 -40 to +85 -55 to 150 Min Typ Max 14 0 Unit kV °C °C °C V Unit V µA pF Ω kΩ kΩ ...

Page 3

... EMIF06-HMC01F2 Figure 3. S21 (dB) attenuation measurement Figure 4. 0. 10.00 - 20.00 - 30.00 - 40.00 - 50.00 100.0k 1.0M 10.0M f/Hz Figure 5. ESD response to IEC 61000-4-2 (+15kV air discharge) on one input (V ) and on one output (V in Input 10V/d Output 10V/d 200ns/d Figure 7. Junction capacitance versus reverse voltage applied (typical values) ...

Page 4

... Rbump Lgnd Rgnd Cgnd Variables Cz 11pF Cz_gnd 45pF RS_gnd 480m Ls 950pH Rs 150m Rbump 100m Lbump 50pH Cbump 0.15pF Lgnd 50pH Rgnd 100m Cgnd 0.15pF EMIF06-HMC01F2 Rbump Lbump clk clk Rsub Cbump cmd bulk dat0 Rbump Lbump cmd dat1 Rsub Cbump dat2 ...

Page 5

... EMIF06-HMC01F2 3 Ordering information scheme Figure 10. Ordering information scheme EMI Filter Number of lines Information x = resistance value (Ohms capacitance value / 10(pF letters = application 2 digits = version Package F = Flip Chip Lead-free, pitch = 500 µm, bump = 315 µm 4 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK packages ...

Page 6

... Ordering information Table 3. Ordering information Order code EMIF06-HMC01F2 6/8 Figure 13. Marking Dot identifying Pin A1 location 0.73 ± 0.05 User direction of unreeling All dimensions in mm Marking Package GH Flip Chip EMIF06-HMC01F2 Dot, ST logo xx = marking z = manuafacturing location yww = datecode (y = year week Ø 1.5 ± 0.1 4 ± ...

Page 7

... EMIF06-HMC01F2 6 Revision history Table 4. Document revision history Date 25-Jan-2005 28-Apr-2008 Revision 1 Initial release. Updated ECOPACK statement. Updated 2 Figure 12, Figure 13 standards. Revision history Changes Figure 10, Figure and Figure 14. Reformatted to current 11, 7/8 ...

Page 8

... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 8/8 Please Read Carefully: © 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com EMIF06-HMC01F2 ...

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