TGC4405 TriQuint, TGC4405 Datasheet - Page 11
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TGC4405
Manufacturer Part Number
TGC4405
Description
Wireless Accessories 17 - 27GHz Upconverter
Manufacturer
TriQuint
Datasheet
1.TGC4405.pdf
(11 pages)
Specifications of TGC4405
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
1061094
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TGC4405
Manufacturer:
Triquint
Quantity:
1 400
Company:
Part Number:
TGC4405-SM
Manufacturer:
Triquint
Quantity:
1 400
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Component placement and adhesive attachment assembly notes:
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Reflow process assembly notes:
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Interconnect process assembly notes:
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Vacuum pencils and/or vacuum collets are the preferred method of pick up.
Air bridges must be avoided during placement.
The force impact is critical during auto placement.
Organic attachment (i.e. epoxy) can be used in low-power applications.
Curing should be done in a convection oven; proper exhaust is a safety concern.
Use AuSn (80/20) solder and limit exposure to temperatures above 300°C to 3-4 minutes, maximum.
An alloy station or conveyor furnace with reducing atmosphere should be used.
Do not use any kind of flux.
Coefficient of thermal expansion matching is critical for long-term reliability.
Devices must be stored in a dry nitrogen atmosphere.
Thermosonic ball bonding is the preferred interconnect technique.
Force, time, and ultrasonics are critical parameters.
Aluminum wire should not be used.
Devices with small pad sizes should be bonded with 0.0007-inch wire.
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
TGC4405
Ordering Information
Part
Assembly Notes
Oct 2006 © Rev -
GaAs MMIC Die
Package Style
TGC4405
11