TGC4405 TriQuint, TGC4405 Datasheet - Page 9

• Manufacturer Part Number: TGC4405
• Description: Wireless Accessories 17 - 27GHz Upconverter
• Manufacturer: TriQuint

Specifications of TGC4405

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1061094

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Bond Pad #1
Bond Pad #2
Bond Pad #3
Bond Pad #4
Bond Pad #5
TriQuint Semiconductor: www. triquint.com [phone] Fax [phone] [e-mail]
RF Out
LO In
IF In
1.930
1.842
1.233
0.095
Vd
Vd
0.0
Units: millimeters
Thickness: 0.10
Die x,y size tolerance: +/- 0.05
Chip edge to bond pad dimensions are shown to center of pad
Ground is backside of die
2
1
3
0.100 x 0.100
0.100 x 0.150
0.170 x 0.085
0.085 x 0.085
0.085 x 0.085
Mechanical Drawing
10
4
Oct 2006 © Rev -
9
Bond Pad #10
Bond Pad #6
Bond Pad #7
Bond Pad #8
Bond Pad #9
5
6
7
8
Vmxr
Vdbl
Vg
Vd
Vg
0.705
TGC4405
0.085 x 0.085
0.085 x 0.085
0.081 x 0.081
0.081 x 0.081
0.081 x 0.081
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