MINIASMDC150F/16-2 Tyco Electronics, MINIASMDC150F/16-2 Datasheet - Page 8

• Manufacturer Part Number: MINIASMDC150F/16-2
• Description: TPE / MINI-SMD
• Manufacturer: Tyco Electronics

Specifications of MINIASMDC150F/16-2

• Hold Current: 1.5 Amps
• Trip Current: 2.8 Amps
• Current Rating (max): 100 Amps
• Resistance: 0.11 Ohms
• Maximum Voltage: 16 Volts
• Termination Style: Solder Pad
• Mounting Style: SMD/SMT
• Dimensions: 4.83 mm L x 3.41 mm W x 0.48 mm H
• Package / Case: 1812 (4532 metric)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: RF2160-000

Recommended Pad Layout
Soldering Refl ow and Rework Recommendations
Note : All temperatures refer to topside of the package, measured on the package body surface.
Solder Refl ow
• Recommended refl ow methods: IR, hot air and Nitrogen
• Recommended maximum paste thickness : 0.25mm (0.010 inch)
• Devices can be cleaned using standard methods and aqueous solvents.
• Tyco Electronics believes the optimum conditions for forming acceptable solder fi llets occur when a reasonable amount of solder paste is
• Tyco Electronics requests that customer board layouts refrain from placing raised features (e.g. vias, nomenclature, traces, etc.)
Rework
• Standard industry practices. Please also avoid direct contact to the device.
Classifi cation Refl ow Profi les
Part Number
nanoASMD device
microASMD device
miniASMD device
AHS080-2018 device
AHS160~AHS300 devices
ASMD030F~ASMD125F devices
ASMD150F~ASMD250F devices
Profi le Feature
Average Ramp-Up Rate (Ts
Preheat
• Temperature Min (Ts
• Temperature Max (Ts
• Time (ts
Time maintained above:
• Temperature (T
• Time (t
Peak/Classifi cation Temperature (Tp)
Time within 5°C of actual Peak Temperature
Time (tp)
Ramp-Down Rate
placed underneath each device’s termination. As such, we request that customers comply with our recommended solder pad layouts.
underneath PolySwitch devices. It is possible that raised features could negatively impact solderability performance of our devices.
L
)
MIN
to ts
L
MAX
)
)
MIN
MAX
)
)
MAX
to Tp)
2.50 (0.098)
4.60 (0.180)
4.60 (0.180)
4.60 (0.180)
Dimension
1.60 (0.063)
2.95 (0.114)
3.10 (0.120)
A (Nom.)
Recommended Pad Layout Figures [mm (In.)]
Pb-Free Assembly
3°C/s max
150°C
200°C
60-120 s
217°C
60-150 s
260°C
30 s max
3°C/s max
2.30 (0.090)
2.30 (0.090)
2.30 (0.090)
Dimension
1.00 (0.039)
1.00 (0.039)
1.68 (0.066)
1.50 (0.059)
B (Nom.)
8
2.00 (0.079)
2.00 (0.079)
3.40 (0.134)
6.10 (0.240)
6.10 (0.240)
Dimension
3.10 (0.122)
5.10 (0.201)
C (Nom.)
Reflow Profile
25
Tp
T
L
Refl ow Profi le
Ts
Ts
MIN
MAX
Preheat
t 25˚C to Peak
ts
B
Ramp up
Time
C
Ramp down
tp
t
L
B
Critical Zone
T
L
to Tp
A