7-338069-8 TE Connectivity, 7-338069-8 Datasheet - Page 6

• Manufacturer Part Number: 7-338069-8
• Description: SOCKET, TOP ENTRY, SMT, 8WAY
• Manufacturer: TE Connectivity
• Type: FFC Connectorr
• Series: Micro-MaTchr

Specifications of 7-338069-8

• Contact Gender: F
• Mounting Style: Surface Mount
• Number Of Contact Rows: 2
• Number Of Contacts: 8POS
• Pitch (mm): 2.54mm
• Body Orientation: Straight
• Contact Resistance Max: 10mOhm
• Operating Temp Range: -40C to 105C
• Housing Material: Polyamide 4.6
• Housing Color: Red
• Contact Material: Phosphor Bronze
• Contact Plating: Tin Over Nickel
• Termination Method: Solder
• Product Height (mm): 5.3mm
• Product Depth (mm): 5mm
• Product Length (mm): 14.7mm
• Connector Type: Board To Board
• Pitch Spacing: 1.27mm
• No. Of Rows: 1
• No. Of Contacts: 8
• Gender: Receptacle
• Contact Termination: Surface Mount Vertical
• Contact: RoHS Compliant
• Rohs Compliant: Yes
• Product Type: Connector
• Type Of Connector: Female-On-Board
• Mount Angle: Vertical
• Pcb Mount Style: Surface Mount
• Mating Connector Lock: With
• Polarization: With
• Number Of Positions: 8
• Locking Latch: With
• Centerline (mm [in]): 1.27 [0.050]
• Vacuum Tape: With
• Contact Base Material: Phosphor Bronze
• Contact Plating, Mating Area, Material: Tin
• Housing Entry Style: Top
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C, Reflow solder capable to 260°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Applies To: Printed Circuit Board
• Packaging Method: Reel
• Packaging Quantity: 900
• Lead Free Status / RoHS Status: Compliant

.
Rev. F
R6-77 (Rev. 07-01)
3.6.1.
3.6.2.
3.6.3.
3.6.4.
3.6.5.
Para.
3.6.6.
3.6.7.
3.6.8.
Examination of product
Solderability for through hole
versions
Resistance to soldering heat
for through hole versions
Solderability for SMD
Resistance to Soldering Heat
for SMD
Insulation resistance
Voltage proof
Termination resistance
Measuring points
Termination resistance
Test description
Test description
Meets requirements of product
drawing and applicable AMP
spec. 114-19016, 114-19051 or
114-19027.
Solderbath temp 235°C.
Ageing 3-16 hrs at 155°C
Max. 5% dewetting
Solderbath temp. 265°C
Dip duration: 10 seconds
Mount connectors in a PC-Board
as intended to be applied.
Requirement: No detrimental
effects.
Appearance of the specimen shall
be inspected after the test with
10x magnification of any damage
such as pinholes, void or rough
surface.
3 cycles of 260°C peak reflow
soldering simulation curve.
Test severity shall not include
moisture soak.
Requirement: No detrimental
effects.
Test voltage 100V DC- or AC-
peak. Duration: 1 minute.
Requirement: 1000 MΩ min.
Test voltage: 500 VAC.
Duration: 1 minute
Requirement: No break-down
or flash-over
Maximum open voltage 20
Millivolts. Maximum current 100
Milliampers. Termination
resistance consists of bulk cable +
bulk connectors and contact
resistance. Requirement: 10
Milliohms max. (excluding bulk
cable)
E L E C T R I C A L
Performance Requirements
Performance Requirements
VISUAL
or Severity
or Severity
Visual,
functional
inspection plan. In acc. with
IEC 512-2 test 1a.
Magnification 10 x.
In acc. with IEC 68-2-20
Test Ta
In acc. with:
Tyco Test Spec 109-202
Method § 4.3.B.
Provisional standards of EIA
of
( Test methods of soldering or
surface
Para 2.4.2. ( Reflow soldering
method )
In acc. with:
Tyco Test Spec 109-201
Reflow curve § 3.4.B.2.
In acc. with IEC 512-2 test 3a.
In acc. with IEC 512-2 test 4a.
In acc. with IEC 512-2 test 2a.
Under dry circuit conditions.
All contacts measured.
JAPAN.
Procedures
mounting
dimensional
Procedures
per
RCX-0102/101
108-19052
Page 6 of 15
applicable
devices)
and