ISZ-500 INVENSENSE, ISZ-500 Datasheet - Page 19

• Manufacturer Part Number: ISZ-500
• Description: GYRO, SINGLE (Z) AXIS, +/-500 DEG/S
• Manufacturer: INVENSENSE

Specifications of ISZ-500

• No. Of Axes: 1
• Sensor Case Style: QFN
• No. Of Pins: 28
• Supply Voltage Range: 2.7V To 3.3V
• Operating Temperature Range: -20°C To +85°C
• Sensitivity Per Axis: 2mV / ° / S
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

9.6
Routing traces or vias under the gyro package such that they run under the exposed die pad is prohibited.
9.7
The exposed die pad is internally connected to VSS, and should not be soldered to the PCB since soldering
to it contributes to performance changes due to package thermo-mechanical stress.
9.8
There are no specific design considerations other than generally accepted industry design practices for
component placement near the ISZ-500 gyroscope to prevent noise coupling.
9.9
The gyro pin marked ZAGC is a high impedance node that is sensitive to current leakage, which can impact
gyroscope performance. Care should be taken to ensure that this node is not contaminated by residue such
as flux and is clean.
9.10 MEMS Handling Instructions
MEMS (Micro Electro-Mechanical Systems) are a time-proven, robust technology used in hundreds of
millions of consumer, automotive and industrial products. MEMS devices consist of microscopic moving
mechanical structures. They differ from conventional IC products even though they can be found in similar
packages. Therefore, MEMS devices require different handling precautions than conventional ICs prior to
mounting onto printed circuit boards (PCBs).
InvenSense’s ISZ-500 gyroscopes have a shock tolerance of 10,000g. InvenSense packages its gyroscopes
as it deems proper for protection against normal handling and shipping. It recommends the following
handling precautions to prevent potential damage:


9.11 Gyroscope Surface Mount Guidelines
Any material used in the surface mount assembly process of the MEMS gyroscope should be free of
restricted RoHS elements or compounds. Pb-free solders should be used for assembly.
In order to assure gyroscope performance, several industry standard guidelines need to be considered for
surface mounting. These guidelines are for both printed circuit board (PCB) design and surface mount
assembly and are available from packaging and assembly houses.
When using MEMS gyroscope components in plastic packages, package stress due to PCB mounting and
assembly could affect the output offset and its value over a wide range of temperatures. This is caused by
the mismatch between the Coefficient Temperature Expansion (CTE) of the package material and the PCB.
Care must be taken to avoid package stress due to mounting.
9.12 PCB Mounting and Cross-Axis Sensitivity
Orientation errors of the gyroscope mounted to the printed circuit board can cause cross-axis sensitivity in
which one gyro responds to rotation about another axis, for example, the Z-axis gyroscope responding to
rotation about the X or Y axes. The orientation mounting errors are illustrated in the figure below.
CONFIDENTIAL & PROPRIETARY
Individually packaged gyroscopes or trays of gyroscopes should not be dropped on hard surfaces.
Components placed in trays could be subject to g-forces in excess of 10,000g if dropped.
Printed circuit boards that incorporate mounted gyroscopes should not be separated by manually
snapping apart. This could also create g-forces in excess of 10,000g.
Trace Routing
Soldering Exposed Die Pad
Component Placement
AGC Node
ISZ-500 Single-Axis Z-Gyroscope
Product Specification
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PS-ISZ-0500B-00-03
Release Date: 07/08/09