AD5422BREZ Analog Devices Inc, AD5422BREZ Datasheet - Page 10

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AD5422BREZ

Manufacturer Part Number
AD5422BREZ
Description
16 Bit V, I Out DAC
Manufacturer
Analog Devices Inc
Datasheet

Specifications of AD5422BREZ

Design Resources
16-Bit Fully Isolated Output Module Using AD5422 and ADuM1401 (CN0065) Simplified 16-Bit Voltage Output and 4 mA-to-20 mA Output Solution Using AD5422 (CN0077)
Settling Time
25µs
Number Of Bits
16
Data Interface
MICROWIRE™, Serial, SPI™
Number Of Converters
1
Voltage Supply Source
Analog and Digital, Dual ±
Power Dissipation (max)
950mW
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
24-TSSOP Exposed Pad, 24-eTSSOP, 24-HTSSOP
Number Of Channels
1
Resolution
16b
Conversion Rate
40KSPS
Interface Type
Serial (3-Wire, SPI, QSPI, Microwire)
Single Supply Voltage (typ)
12/15/18/24/28V
Dual Supply Voltage (typ)
±12/±15/±18/±24/±28V
Architecture
R-2R
Power Supply Requirement
Single/Dual
Output Type
Current/Voltage
Single Supply Voltage (min)
10.8V
Single Supply Voltage (max)
40V
Dual Supply Voltage (min)
0/10.8V
Dual Supply Voltage (max)
-26.4/40V
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
24
Package Type
TSSOP EP
Rohs Compliant
Yes
Input Channel Type
Serial
Supply Voltage Range - Digital
2.7V To 5.5V
Supply Current
3.9mA
Digital Ic Case Style
TSSOP
No. Of Pins
24
Operating Temperature Range
-40°C To +85°C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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AD5412/AD5422
ABSOLUTE MAXIMUM RATINGS
T
80 mA do not cause SCR latch-up.
Table 5.
Parameter
AV
AV
AV
DV
Digital Inputs to GND
Digital Outputs to GND
REFIN/REFOUT to GND
V
I
Operating Temperature Range (T
Storage Temperature Range
Junction Temperature (T
24-Lead TSSOP Package
40-Lead LFCSP Package
Power Dissipation
Lead Temperature
ESD (Human Body Model)
1
OUT
Power dissipated on chip must be derated to keep the junction temperature
below 125°C, assuming that the maximum power dissipation condition is
sourcing 24 mA into GND from I
OUT
A
Industrial
θ
θ
Soldering
DD
SS
DD
CC
= 25°C, unless otherwise noted. Transient currents of up to
to GND
JA
JA
to GND
to GND
to GND
to AV
to GND
Thermal Impedance
Thermal Impedance
SS
1
J
max)
OUT
with a 4 mA on-chip current.
A
)
Rating
−0.3 V to +48 V
+0.3 V to −28 V
−0.3 V to +60 V
−0.3 V to +7 V
−0.3 V to DV
−0.3 V to DV
−0.3 V to +7 V
AV
−0.3 V to AV
−40°C to +85°C
−65°C to +150°C
125°C
42°C/W
28°C/W
(T
JEDEC industry standard
J-STD-020
2 kV
(whichever is less)
(whichever is less)
J
SS
max – T
to AV
DD
A
)/θ
DD
CC
CC
JA
+ 0.3 V or 7 V
+ 0.3 V or 7 V
Rev. C | Page 10 of 40
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION

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