AD6636BBCZ Analog Devices Inc, AD6636BBCZ Datasheet - Page 10

IC,Downconverter,CMOS,BGA,256PIN,PLASTIC

AD6636BBCZ

Manufacturer Part Number
AD6636BBCZ
Description
IC,Downconverter,CMOS,BGA,256PIN,PLASTIC
Manufacturer
Analog Devices Inc
Series
AD6636r
Datasheet

Specifications of AD6636BBCZ

Rf Type
Cellular, CDMA2000, EDGE, GPRS, GSM
Number Of Mixers
1
Secondary Attributes
Down Converter
Current - Supply
450mA
Voltage - Supply
3 V ~ 3.6 V
Package / Case
256-CSPBGA
Pin Count
256
Screening Level
Industrial
Package Type
CSPBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Frequency
-
Gain
-
Noise Figure
-
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AD6636BBCZ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
AD6636
ABSOLUTE MAXIMUM RATINGS
Table 7.
Parameter
ELECTRICAL
ENVIRONMENTAL
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
VDDCORE Supply Voltage
VDDIO Supply Voltage
Input Voltage
Output Voltage
Load Capacitance
Operating Temperature
Maximum Junction
Storage Temperature
(Core Supply)
(Ring or IO Supply)
Range (Ambient)
Temperature Under Bias
Range (Ambient)
Rating
2.2 V
4.0 V
−0.3 to +3.6 V (Not 5 V Tolerant)
−0.3 to VDDIO + 0.3 V
200 pF
−40°C to +85°C
125°C
−65°C to +150°C
Rev. A | Page 10 of 80
Stresses above those listed under the Absolute Maximum
Ratings may cause permanent damage to the device. This is a
stress rating only; functional operation of the device at these or
any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
256-ball CSP_BGA package:
Thermal measurements made in the horizontal position on a
4-layer board with vias.
θ
θ
θ
θ
JA
JA
JA
JA
= 25.4°C /W, no airflow
= 23.3°C /W, 0.5 m/s airflow
= 22.6°C /W, 1.0 m/s airflow
= 21.9°C /W, 2.0 m/s airflow

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