AD797BRZ-REEL Analog Devices Inc, AD797BRZ-REEL Datasheet - Page 5

• Manufacturer Part Number: AD797BRZ-REEL
• Description: IC,Operational Amplifier,SINGLE,BIPOLAR,SOP,8PIN,PLASTIC
• Manufacturer: Analog Devices Inc

Specifications of AD797BRZ-REEL

• Amplifier Type: General Purpose
• Number Of Circuits: 1
• Slew Rate: 20 V/µs
• Gain Bandwidth Product: 110MHz
• -3db Bandwidth: 8MHz
• Current - Input Bias: 250nA
• Voltage - Input Offset: 10µV
• Current - Supply: 8.2mA
• Current - Output / Channel: 50mA
• Voltage - Supply, Single/dual (±): ±5 V ~ 15 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Output Type: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage
Input Voltage
Differential Input Voltage
Output Short-Circuit Duration
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering 60 sec)
1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
The AD797 inputs are protected by back-to-back diodes. To achieve low
noise, internal current-limiting resistors are not incorporated into the design
of this amplifier. If the differential input voltage exceeds ±0.7 V, the input
current should be limited to less than 25 mA by series protection resistors.
Note, however, that this degrades the low noise performance of the device.
(N, R Suffix)
1
Ratings
±18 V
±V
±0.7 V
Indefinite within
maximum internal
power dissipation
−65°C to +125°C
−40°C to +85°C
300°C
S
Rev. H | Page 5 of 20
THERMAL RESISTANCE
θ
standard printed circuit board (PCB) with zero airflow for the
SOIC package, and a 2-layer JEDEC standard printed circuit
board (PCB) with zero airflow for the PDIP package.
Table 4. Thermal Resistance
Package Type
8-Lead SOIC (R-8)
8-Lead PDIP (N-8)
ESD CAUTION
JA
is specified for the device soldered on a 4-layer JEDEC
Figure 2. 8-Lead Plastic Dual In-Line Package [PDIP] and
OFFSET NULL
8-Lead Standard Small Outline Package [SOIC]
–V
–IN
+IN
PIN CONFIGURATION
S
1
2
3
4
TOP VIEW
AD797
8
7
6
5
DECOMPENSATION
AND DISTORTION
NEUTRALIZATION
+V
OUTPUT
OFFSET NULL
θ
120
103
S
JA
θ
43
50
JC
AD797
Unit
°C/W
°C/W