AD8131ARM Analog Devices Inc, AD8131ARM Datasheet - Page 7
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AD8131ARM
Manufacturer Part Number
AD8131ARM
Description
Amplifier IC
Manufacturer
Analog Devices Inc
Datasheet
1.AD8131ARMZ-REEL7.pdf
(20 pages)
Specifications of AD8131ARM
No. Of Amplifiers
1
Bandwidth
620MHz
Slew Rate
2000V/µs
No. Of Pins
8
Mounting Type
Surface Mount
Peak Reflow Compatible (260 C)
No
Leaded Process Compatible
No
Package / Case
8-uSOIC
Rohs Status
RoHS non-compliant
Amplifier Type
Differential
Number Of Circuits
1
Output Type
Differential
-3db Bandwidth
400MHz
Current - Input Bias
500nA
Voltage - Input Offset
1500µV
Current - Supply
11.5mA
Current - Output / Channel
60mA
Voltage - Supply, Single/dual (±)
2.8 V ~ 11 V, ±1.4 V ~ 5.5 V
Operating Temperature
-40°C ~ 125°C
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Gain Bandwidth Product
-
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
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Part Number:
AD8131ARM
Manufacturer:
ADI
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20 000
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Part Number:
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Manufacturer:
SIEMENS
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Part Number:
AD8131ARMZ-REEL
Manufacturer:
ADI/亚德诺
Quantity:
20 000
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Supply Voltage
V
Internal Power Dissipation
Operating Temperature Range
Storage Temperature Range
Lead Temperature (Soldering 10 sec)
1
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Thermal resistance measured on SEMI standard 4-layer board.
8-lead SOIC: θ
8-lead MSOP: θ
OCM
1
JA
JA
= 121°C/W.
= 142°C/W.
Rating
±5.5 V
±V
250 mW
−40°C to +125°C
−65°C to +150°C
300°C
S
Rev. B | Page 7 of 20
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only, functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Figure 3. Plot of Maximum Power Dissipation vs. Temperature
2.0
1.5
1.0
0.5
0
–50
–20
PACKAGE
8-LEAD SOIC
AMBIENT TEMPERATURE (°C)
8-LEAD
PACKAGE
MSOP
10
40
70
T
100
J
= 150°C
AD8131
130