AD8131ARM Analog Devices Inc, AD8131ARM Datasheet - Page 7

• Manufacturer Part Number: AD8131ARM
• Description: Amplifier IC
• Manufacturer: Analog Devices Inc

Specifications of AD8131ARM

• No. Of Amplifiers: 1
• Bandwidth: 620MHz
• Slew Rate: 2000V/µs
• No. Of Pins: 8
• Mounting Type: Surface Mount
• Peak Reflow Compatible (260 C): No
• Leaded Process Compatible: No
• Package / Case: 8-uSOIC
• Rohs Status: RoHS non-compliant
• Amplifier Type: Differential
• Number Of Circuits: 1
• Output Type: Differential
• -3db Bandwidth: 400MHz
• Current - Input Bias: 500nA
• Voltage - Input Offset: 1500µV
• Current - Supply: 11.5mA
• Current - Output / Channel: 60mA
• Voltage - Supply, Single/dual (±): 2.8 V ~ 11 V, ±1.4 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Gain Bandwidth Product: -
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Supply Voltage
V
Internal Power Dissipation
Operating Temperature Range
Storage Temperature Range
Lead Temperature (Soldering 10 sec)
1
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Thermal resistance measured on SEMI standard 4-layer board.
8-lead SOIC: θ
8-lead MSOP: θ
OCM
1
JA
JA
= 121°C/W.
= 142°C/W.
Rating
±5.5 V
±V
250 mW
−40°C to +125°C
−65°C to +150°C
300°C
S
Rev. B | Page 7 of 20
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only, functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Figure 3. Plot of Maximum Power Dissipation vs. Temperature
2.0
1.5
1.0
0.5
0
–50
–20
PACKAGE
8-LEAD SOIC
AMBIENT TEMPERATURE (°C)
8-LEAD
PACKAGE
MSOP
10
40
70
T
100
J
= 150°C
AD8131
130