AD9238BSTZ-40 Analog Devices Inc, AD9238BSTZ-40 Datasheet - Page 44

• Manufacturer Part Number: AD9238BSTZ-40
• Description: IC,A/D CONVERTER,DUAL,12-BIT,CMOS,QFP,64PIN
• Manufacturer: Analog Devices Inc

Specifications of AD9238BSTZ-40

• Rohs Compliant: YES
• Number Of Bits: 12
• Sampling Rate (per Second): 40M
• Data Interface: Parallel
• Number Of Converters: 2
• Power Dissipation (max): 330mW
• Voltage Supply Source: Single Supply
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 64-LQFP
• Number Of Elements: 2
• Resolution: 12Bit
• Architecture: Pipelined
• Sample Rate: 40MSPS
• Input Polarity: Unipolar
• Input Type: Voltage
• Rated Input Volt: ±0.5/±1V
• Differential Input: Yes
• Power Supply Requirement: Single
• Single Supply Voltage (typ): 3V
• Single Supply Voltage (min): 2.7V
• Single Supply Voltage (max): 3.6V
• Dual Supply Voltage (typ): Not RequiredV
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Power Dissipation: 397mW
• Differential Linearity Error: ±0.8LSB
• Integral Nonlinearity Error: ±1.4LSB
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 64
• Package Type: LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AD9238BCP-65EBZ - BOARD EVAL WITH AD9238BCP-65AD9238BCP-40EBZ - BOARD EVAL WITH AD9238BCP-40
• Lead Free Status / Rohs Status: Compliant

AD9238
Figure 58. PCB Bottom-Side Silkscreen
THERMAL CONSIDERATIONS
The AD9238 LFCSP has an integrated heat slug that improves
the thermal and electrical properties of the package when locally
attached to a ground plane at the PCB. A thermal (filled) via array
to a ground plane beneath the part provides a path for heat to
escape the package, lowering junction temperature. Improved
electrical performance also results from the reduction in package
parasitics due to proximity of the ground plane. Recommended
array is 0.3 mm vias on 1.2 mm pitch. θ
= 26.4°C/W with this
JA
recommended configuration. Soldering the slug to the PCB is a
requirement for this package.
Figure 59. Thermal Via Array
Rev. C | Page 44 of 48