AD9245BCPZ-40 Analog Devices Inc, AD9245BCPZ-40 Datasheet - Page 29
![IC,A/D CONVERTER,SINGLE,14-BIT,CMOS,LLCC,32PIN](/photos/6/64/66408/32-lfcsp_sml.jpg)
AD9245BCPZ-40
Manufacturer Part Number
AD9245BCPZ-40
Description
IC,A/D CONVERTER,SINGLE,14-BIT,CMOS,LLCC,32PIN
Manufacturer
Analog Devices Inc
Datasheet
1.AD9245BCPZ-80.pdf
(32 pages)
Specifications of AD9245BCPZ-40
Number Of Bits
14
Sampling Rate (per Second)
40M
Data Interface
Parallel
Number Of Converters
3
Power Dissipation (max)
165mW
Voltage Supply Source
Single Supply
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
32-VFQFN, CSP Exposed Pad
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AD9245BCP-80EBZ - BOARD EVAL FOR AD9245BCP-80AD9245BCP-40EBZ - BOARD EVAL FOR AD9245BCP-40AD9245BCP-20EBZ - BOARD EVAL FOR AD9245BCP-20
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AD9245BCPZ-40
Manufacturer:
ADI/亚德诺
Quantity:
20 000
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
AD9245BCP-80
AD9245BCPRL7–80
AD9245BCPZ-80
AD9245BCPZRL7-80
AD9245BCPZ-65
AD9245BCPZRL7-65
AD9245BCPZ-40
AD9245BCPZRL7-40
AD9245BCPZ-20
AD9245BCPZRL7-20
AD9245BCP-80EB
AD9245BCP-65EB
AD9245BCP-40EB
AD9245BCP-20EB
1
2
It is recommended that the exposed paddle be soldered to the ground plane for the LFCSP package. There is an increased reliability of the solder joints, and the
maximum thermal capability of the package is achieved with the exposed paddle soldered to the customer board.
Z = Pb-free part.
2
2
2
2
2
2
2
2
INDICATOR
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
1.00
0.85
0.80
PIN 1
12° MAX
SEATING
PLANE
BSC SQ
VIEW
TOP
5.00
Figure 58. 32-Lead Frame Chip Scale Package [LFCSP_VQ]
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
0.80 MAX
0.65 TYP
0.30
0.23
0.18
5 mm × 5 mm Body, Very Thin Quad
Package Description
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
Evaluation Board
Evaluation Board
Evaluation Board
Evaluation Board
Dimensions shown in millimeters
BSC SQ
4.75
0.20 REF
Rev. D | Page 29 of 32
0.05 MAX
0.02 NOM
(CP-32-2)
0.60 MAX
COPLANARITY
BSC
0.50
0.40
0.30
0.50
0.08
1
24
17
16
25
(BOTTOM VIEW)
0.60 MAX
EXPOSED
PAD
32
9
1
8
3.50 REF
3.25
3.10 SQ
2.95
0.25 MIN
PIN 1
INDICATOR
Package Option
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
AD9245