AD9889B/PCBZ Analog Devices Inc, AD9889B/PCBZ Datasheet - Page 12

• Manufacturer Part Number: AD9889B/PCBZ
• Description: Pb-free EVALUATION Kit AD9889B
• Manufacturer: Analog Devices Inc
• Series: Advantiv®r

Specifications of AD9889B/PCBZ

• Main Purpose: Video, Video Processing
• Embedded: No
• Utilized Ic / Part: AD9889B
• Primary Attributes: HDMI/DVI Transmitter
• Secondary Attributes: Color Space Converter, RGB, YCbCr, and DDR Compatible
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: Q5248134

AD9889B
ORDERING GUIDE
Model
AD9889BBCPZ-80
AD9889BBCPZ-165
AD9889BBSTZ-80
AD9889BBSTZ-165
AD9889BBBCZ-80
AD9889BBBCZRL-80
AD9889B/PCBZ
1
I
©2007–2010 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
2
Z = RoHS Compliant Part.
C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
1
* 1.40 MAX
−25°C to +85°C
−25°C to +85°C
−25°C to +85°C
Temperature Range
−25°C to +85°C
−25°C to +85°C
−25°C to +85°C
D06291-0-3/10(A)
DETAIL A
Figure 7. 76-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
TOP VIEW
BALL A1
PAD CORNER
6.10
6.00 SQ
5.90
* COMPLIANT TO JEDEC STANDARDS MO-225
WITH THE EXCEPTION TO PACKAGE HEIGHT.
Dimensions shown in millimeters
Package Description
64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
80-Lead Low Profile Quad Flat Package [LQFP]
80-Lead Low Profile Quad Flat Package [LQFP]
76-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
76-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
Evaluation Board
6 mm × 6 mm × 1.4 mm
Rev. A | Page 12 of 12
BSC SQ
0.15 MIN
4.50
(BC-76-1)
BSC
0.50
REF
0.75
10
BALL DIAMETER
9
DETAIL A
8 7 6
BOTTOM VIEW
0.35
0.30
0.25
SEATING
PLANE
5 4
INDEX AREA
A1 CORNER
3 2 1
0.65 MIN
COPLANARITY
0.08 MAX
A
B
C
D
E
F
G
H
J
K
Package Option
CP-64-1
CP-64-1
ST-80-2
ST-80-2
BC-76-1
BC-76-1