ADG1406BRUZ Analog Devices Inc, ADG1406BRUZ Datasheet - Page 20

• Manufacturer Part Number: ADG1406BRUZ
• Description: 10 Max Ron, ?15V, +12V ICMOS 16:1 MUX
• Manufacturer: Analog Devices Inc
• Series: iCMOS®r
• Type: Analog Multiplexerr

Specifications of ADG1406BRUZ

• Function: Multiplexer
• Circuit: 1 x 8:1
• On-state Resistance: 11.5 Ohm
• Voltage Supply Source: Single Supply
• Voltage - Supply, Single/dual (±): 12V, 15V
• Current - Supply: 1µA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 28-TSSOP (0.173", 4.40mm Width)
• Package: 28TSSOP
• Maximum On Resistance: 25@±4.5V Ohm
• Maximum Propagation Delay Bus To Bus: 160@±15V|250@12V|435@±5V ns
• Multiplexer Architecture: 16:1
• Maximum Turn-off Time: 290@±5V ns
• Maximum Turn-on Time: 335@±5V ns
• Power Supply Type: Single|Dual
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADG1406/ADG1407
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
ADG1406BRUZ
ADG1406BRUZ-REEL7
ADG1406BCPZ-REEL7
ADG1407BRUZ
ADG1407BRUZ-REEL7
ADG1407BCPZ-REEL7
1
©2008–2009 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
Z = RoHS Compliant Part.
1
1
1
1
1
1
INDICATOR
1.00
0.85
0.80
PIN 1
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
12° MAX
SEATING
PLANE
COPLANARITY
0.15
0.05
PIN 1
D07419-0-3/09(A)
BSC SQ
0.10
VIEW
TOP
5.00
Figure 39. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Figure 38. 28-Lead Thin Shrink Small Outline Package [TSSOP]
2 8
1
0.80 MAX
0.65 TYP
0.30
0.23
0.18
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
COMPLIANT TO JEDEC STANDARDS MO-153-AE
0.30
0.19
BSC
0.65
BSC SQ
5 mm × 5 mm Body, Very Thin Quad
Dimensions shown in millimeters
0.20 REF
Dimensions shown in millimeters
4.75
9.80
9.70
9.60
Description
28-Lead Thin Shrink Small Outline Package [TSSOP]
28-Lead Thin Shrink Small Outline Package [TSSOP]
32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
28-Lead Thin Shrink Small Outline Package [TSSOP]
28-Lead Thin Shrink Small Outline Package [TSSOP]
32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Rev. A | Page 20 of 20
0.05 MAX
0.02 NOM
1.20 MAX
SEATING
(CP-32-2)
PLANE
(RU-28)
0.60 MAX
COPLANARITY
1 5
1 4
BSC
0.50
0.40
0.30
0.50
0.08
0.20
0.09
4.50
4.40
4.30
24
17
16
25
6.40 BSC
(BOTTOM VIEW)
0.60 MAX
EXPOSED
3.50 REF
8 °
0 °
PAD
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
32
9
0.75
0.60
0.45
1
8
3.25
3.10 SQ
2.95
0.25 MIN
PIN 1
INDICATOR
Package Option
RU-28
RU-28
CP-32-2
RU-28
RU-28
CP-32-2