ADG1433YCPZ-REEL7 Analog Devices Inc, ADG1433YCPZ-REEL7 Datasheet - Page 17

• Manufacturer Part Number: ADG1433YCPZ-REEL7
• Description: IC,ANALOG SWITCH,TRIPLE,SPDT,CMOS,LLCC,16PIN,PLASTIC
• Manufacturer: Analog Devices Inc
• Series: iCMOS®r
• Type: Analog Switchr

Specifications of ADG1433YCPZ-REEL7

• Function: Switch
• Circuit: 3 x SPDT
• On-state Resistance: 4.7 Ohm
• Voltage Supply Source: Dual, Single, Dual Supply
• Voltage - Supply, Single/dual (±): ±5V, 12V, ±15V
• Current - Supply: 1µA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-VQFN, CSP Exposed Pad
• Multiplexer Configuration: Triple SPDT
• Number Of Inputs: 3
• Number Of Outputs: 6
• Number Of Channels: 3
• Analog Switch On Resistance: 9@±4.5VOhm
• Analog Switch Turn On Time: 425ns
• Analog Switch Turn Off Time: 200ns
• Package Type: LFCSP
• Power Supply Requirement: Single/Dual
• Single Supply Voltage (min): 5V
• Single Supply Voltage (typ): 12V
• Single Supply Voltage (max): 16.5V
• Dual Supply Voltage (min): ±4.5V
• Dual Supply Voltage (typ): ±5/±15V
• Dual Supply Voltage (max): ±16.5V
• Supply Current: 0.26mA
• Mounting: Surface Mount
• Pin Count: 16
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Package: 16LFCSP EP
• Maximum On Resistance: 9@±4.5V Ohm
• Maximum Propagation Delay Bus To Bus: 430@±5V|255@12V|170@±15V ns
• Maximum Turn-off Time: 200@±5V ns
• Maximum Turn-on Time: 425@±5V ns
• Switch Architecture: SPDT
• Power Supply Type: Single|Dual
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: ADG1433YCPZ-REEL7TR

ORDERING GUIDE
Model
ADG1433YRUZ
ADG1433YRUZ-REEL
ADG1433YRUZ-REEL7
ADG1433YCPZ-REEL
ADG1433YCPZ-REEL7
ADG1434YRUZ
ADG1434YRUZ-REEL
ADG1434YRUZ-REEL7
ADG1434YCPZ-REEL
ADG1434YCPZ-REEL7
1
Z = RoHS Compliant Part.
1
1
1
1
1
1
1
1
1
1
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
INDICATOR
SEATING
PLANE
1.00
0.85
0.80
PIN 1
COPLANARITY
12° MAX
0.15
0.05
PIN 1
Figure 39. 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Figure 38. 20-Lead Thin Shrink Small Outline Package [TSSOP]
0.10
TOP VIEW
BSC SQ
4.00
20
0.80 MAX
0.65 TYP
1
BSC
0.30
0.23
0.18
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1
0.65
0.30
0.19
COMPLIANT TO JEDEC STANDARDS MO-153-AC
Description
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
6.60
6.50
6.40
Dimensions shown in millimeters
Dimensions shown in millimeters
1.20 MAX
BSC SQ
3.75
0.20 REF
Rev. C | Page 17 of 20
0.05 MAX
0.02 NOM
11
10
SEATING
PLANE
COPLANARITY
(CP-20-4)
0.60 MAX
(RU-20)
0.08
4.50
4.40
4.30
BSC
0.50
0.40
0.30
0.50
0.20
0.09
6.40 BSC
0.60 MAX
15
11
16
10
(BOTTOM VIEW)
EXPOSED
8°
0°
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
PAD
20
6
1
5
2.65
2.50 SQ
2.35
0.25 MIN
0.75
0.60
0.45
ADG1433/ADG1434
EN Pin
Yes
Yes
Yes
Yes
Yes
Yes
Yes
No
No
No
Package Option
RU-16
RU-16
RU-16
CP-16-13
CP-16-13
RU-20
RU-20
RU-20
CP-20-4
CP-20-4