ADG633YRU Analog Devices Inc, ADG633YRU Datasheet - Page 14

• Manufacturer Part Number: ADG633YRU
• Description: IC,ANALOG SWITCH,TRIPLE,SPDT,CMOS,TSSOP,16PIN,PLASTIC
• Manufacturer: Analog Devices Inc
• Type: Analog Switchr

Specifications of ADG633YRU

• Rohs Compliant: NO
• Rohs Status: RoHS non-compliant
• Function: Switch
• Circuit: 3 x SPDT
• On-state Resistance: 75 Ohm
• Voltage Supply Source: Single, Dual Supply
• Voltage - Supply, Single/dual (±): 2 V ~ 12 V, ±2 V ~ 6 V
• Current - Supply: 0.01µA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Multiplexer Configuration: Triple SPDT
• Number Of Inputs: 3
• Number Of Outputs: 6
• Number Of Channels: 3
• Analog Switch On Resistance: 300@3.6VOhm
• Analog Switch Turn On Time: 310ns
• Analog Switch Turn Off Time: 40ns
• Package Type: TSSOP
• Power Supply Requirement: Single/Dual
• Single Supply Voltage (min): 2V
• Single Supply Voltage (typ): 3/5/9V
• Single Supply Voltage (max): 12V
• Dual Supply Voltage (min): ±2V
• Dual Supply Voltage (typ): ±3/±5V
• Dual Supply Voltage (max): ±6V
• Power Dissipation: 0.00001W
• Supply Current: 0.001mA
• Mounting: Surface Mount
• Pin Count: 16
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Package: 16TSSOP
• Maximum On Resistance: 300@3.6V Ohm
• Maximum Propagation Delay Bus To Bus: 90@±5V|150@5V|300@2.7V ns
• Maximum High Level Output Current: 20 mA
• Maximum Turn-off Time: 40@±5V ns
• Maximum Turn-on Time: 310@3.6V ns
• Switch Architecture: SPDT
• Power Supply Type: Single|Dual
• Lead Free Status / Rohs Status: Not Compliant

ADG633
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
ADG633YRU
ADG633YRU-REEL7
ADG633YRUZ
ADG633YRUZ-REEL7
ADG633YCP
ADG633YCP-REEL7
ADG633YCPZ
ADG633YCPZ-REEL7
1
Z = RoHS Compliant Part.
1
1
1
1
−40°C to +125°C
−40°C to +125°C
−40°C to +85°C
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
INDICATOR
1.00
0.85
0.80
PIN 1
0.15
0.05
12° MAX
SEATING
PLANE
4.50
4.40
4.30
PIN 1
Figure 31. 16-Lead Thin Shrink Small Outline Package [TSSOP]
BSC
0.65
BSC SQ
Figure 32. 16-Lead Frame Chip Scale Package [LFCSP_VQ]
VIEW
4.00
16
TOP
1
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC
COPLANARITY
0.80 MAX
0.65 TYP
COMPLIANT TO JEDEC STANDARDS MO-153-AB
0.35
0.30
0.25
5.10
5.00
4.90
0.10
4 mm × 4 mm Body, Very Thin Quad
Dimensions shown in millimeters
Dimensions shown in millimeters
Package Description
16-Lead Thin Shrink Small Outline Package (TSSOP)
16-Lead Thin Shrink Small Outline Package (TSSOP)
16-Lead Thin Shrink Small Outline Package (TSSOP)
16-Lead Thin Shrink Small Outline Package (TSSOP)
16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
0.30
0.19
BSC SQ
0.20 REF
3.75
9
8
Rev. A | Page 14 of 16
1.20
MAX
SEATING
PLANE
0.05 MAX
0.02 NOM
BSC
6.40
(CP-16-4)
(RU-16)
0.65 BSC
COPLANARITY
0.60 MAX
0.20
0.09
0.75
0.60
0.50
0.08
12
9
8°
0°
13
8
(BOTTOM VIEW)
1.95 BSC
0.60 MAX
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
16
5
1
4
0.25 MIN
0.75
0.60
0.45
PIN 1
INDICATOR
Package Option
RU-16
RU-16
RU-16
RU-16
CP-16-4
CP-16-4
CP-16-4
CP-16-4