ADSP-BF514BBCZ-4F4 Analog Devices Inc, ADSP-BF514BBCZ-4F4 Datasheet - Page 62

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ADSP-BF514BBCZ-4F4

Manufacturer Part Number
ADSP-BF514BBCZ-4F4
Description
Low-Pwr BF Proc W/flash & Cnsmr Conctvty
Manufacturer
Analog Devices Inc
Series
Blackfin®r
Type
Fixed Pointr

Specifications of ADSP-BF514BBCZ-4F4

Interface
I²C, PPI, RSI, SPI, SPORT, UART/USART
Clock Rate
400MHz
Non-volatile Memory
FLASH (4Mbit)
On-chip Ram
116kB
Voltage - I/o
1.8V, 2.5V, 3.3V
Voltage - Core
1.30V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
168-LFBGA
Architecture
Modified Harvard
Format
Fixed Point
Clock Freq (max)
400MHz
Device Input Clock Speed
400MHz
Ram Size
48KB
Program Memory Size
1024KB
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Package
168CSP-BGA
Numeric And Arithmetic Format
Fixed-Point
Maximum Speed
400 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ADSP-BF514BBCZ-4F4
Manufacturer:
AD
Quantity:
204
Part Number:
ADSP-BF514BBCZ-4F4
Manufacturer:
Analog Devices Inc
Quantity:
10 000
ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F
Figure 70
tion.
ball configuration.
Figure 71
A1 BALL PAD CORNER
shows the top view of the CSP_BGA ball configura-
shows the bottom view of the CSP_BGA
A
B
C
D
G
H
K
M
N
E
F
J
L
P
NC
14 13 12 11 10
1
2
BOTTOM VIEW
3
Figure 71. 168-Ball CSP_BGA Ball Configuration (Bottom View)
Figure 70. 168-Ball CSP_BGA Ball Configuration (Top View)
4
5
9
6
Rev. B | Page 62 of 68 | January 2011
8
TOP VIEW
7
7
8
6
9
5
10 11 12 13 14
4
3
2
1
NC
A
B
C
D
G
H
K
M
N
E
F
J
L
P
KEY
V
V
V
A1 BALL PAD CORNER
DDFLASH
DDINT
DDEXT
KEY
V
V
V
DDFLASH
DDINT
DDEXT
GND
I/O
GND
I/O
V
V
DDMEM
DDRTC
V
V
DDMEM
DDRTC

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