ADUC7023BCP6Z62I Analog Devices Inc, ADUC7023BCP6Z62I Datasheet - Page 90

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ADUC7023BCP6Z62I

Manufacturer Part Number
ADUC7023BCP6Z62I
Description
Flash ARM7+8-ch,12-B ADC & 4x12-B DAC IC
Manufacturer
Analog Devices Inc
Series
MicroConverter® ADuC7xxxr
Datasheet

Specifications of ADUC7023BCP6Z62I

Core Processor
ARM7
Core Size
16/32-Bit
Speed
44MHz
Connectivity
I²C, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
20
Program Memory Size
62KB (62K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 12 x12b; D/A 4x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
40-LFCSP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ADUC7023BCP6Z62I
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Company:
Part Number:
ADUC7023BCP6Z62I
Quantity:
10 000
Part Number:
ADUC7023BCP6Z62IRL
Manufacturer:
ADI/亚德诺
Quantity:
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ADuC7023
TYPICAL SYSTEM CONFIGURATION
A typical ADuC7023 configuration is shown in Figure 54. It summarizes some of the hardware considerations. The bottom of the LFCSP
package has an exposed pad that needs to be soldered to a metal plate on the board for mechanical reasons. The metal plate of the board
can be connected to ground.
PULL-UPs FOR I
Figure 54. Typical System Configuration
2
C PINS
Rev. B | Page 90 of 96
AV
GND
DAC0
DAC1
DAC2
DAC3
P0.4/IRQ0/SCL0/PLAI[0]/CONV
P0.5/SDA0/PLAI[1]/COMP
DD
REF
ADuC7023
OUT
P0.0/nTRST/ADC BUSY /PLAI[8]/BM
P0.3/PLAO[9]/TCK
P0.2/PLAO[8]/TDI
P0.1/PLAI[9]/TDO
XCLKO
XCLKI
RTCK
TMS

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