ADUC7122BBCZ-RL Analog Devices Inc, ADUC7122BBCZ-RL Datasheet - Page 93
![PRECISION ANALOG MCU I.C](/photos/6/69/66991/bc-108-2_sml.jpg)
ADUC7122BBCZ-RL
Manufacturer Part Number
ADUC7122BBCZ-RL
Description
PRECISION ANALOG MCU I.C
Manufacturer
Analog Devices Inc
Series
MicroConverter® ADuC7xxxr
Datasheet
1.ADUC7122BBCZ.pdf
(96 pages)
Specifications of ADUC7122BBCZ-RL
Core Processor
ARM7
Core Size
16/32-Bit
Speed
41.78MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
32
Program Memory Size
126KB (63K x 16)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 13x12b, D/A 12x12b
Oscillator Type
Internal
Operating Temperature
-10°C ~ 95°C
Package / Case
108-LFBGA, CSPBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
ADUC7122BBCZ-RL
ADUC7122BBCZ-RLTR
ADUC7122BBCZ-RLTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ADUC7122BBCZ-RL
Manufacturer:
Analog Devices Inc
Quantity:
10 000
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
ADuC7122BBCZ
ADuC7122BBCZ-RL
1
Z = RoHS Compliant Part.
1
Temperature Range
−10°C to +95°C
−10°C to +95°C
PAD CORNER
* 1.40 MAX
BALL A1
Figure 39. 108-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
DETAIL A
* COMPLIANT WITH JEDEC STANDARDS MO-195-BD WITH
EXCEPTION TO PACKAGE HEIGHT AND THICKNESS.
TOP VIEW
7.10
7.00 SQ
6.90
Package Description
108-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
108-Ball Chip Scale Package Ball Grid Array [CSP_BGA], 13” Tape and Reel
Dimensions shown in millimeters
Rev. 0 | Page 93 of 96
0.15 MIN
(BC-108-4)
BSC SQ
5.50
BSC
0.50
BALL DIAMETER
0.35
0.30
0.25
12
11
DETAIL A
10
BOTTOM VIEW
9
8 7 6
5 4
SEATING
PLANE
CORNER
A1 BALL
3 2 1
* 1.11 MAX
COPLANARITY
0.08
B
C
D
E
F
G
H
J
K
L
M
A
Package Option
BC-108-4
BC-108-4
ADuC7122