AM29F800BB-90EC Spansion Inc., AM29F800BB-90EC Datasheet - Page 45

• Manufacturer Part Number: AM29F800BB-90EC
• Description: Flash Memory IC
• Manufacturer: Spansion Inc.

Specifications of AM29F800BB-90EC

• Memory Size: 8Mbit
• Memory Configuration: 1M X 8 / 512K X 16
• Ic Interface Type: Parallel
• Access Time: 90ns
• Memory Case Style: TSOP
• No. Of Pins: 48
• Mounting Type: Surface Mount
• Peak Reflow Compatible (260 C): No
• Supply Voltage Max: 5.5V
• Rohs Compliant: No
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

REVISION SUMMARY (Continued)
Revision D (January 1999)
Distinctive Characteristics
Added the 20-year data retention subbullet.
Ordering Information
Optional Processing : Deleted “B = Burn-in”.
DC Characteristics—TTL/NMOS Compatible
I
Changed “A9 = 12.5 V” to “A9 = OE# = RESET = 12.5
V” in the Test Conditions column.
I
Test Conditions.
I
temperatures (>+85°C)”.
DC Characteristics—CMOS Compatible
I
Changed “A9 = 12.5 V” to “A9 = OE# = RESET = 12.5
V” in the Test Conditions column.
I
Note 2 “Maximum I
V
Revision D+1 (March 23, 1999)
Command Definitions table
Corrected SA definition in legend; range should be
A18–A12. In Note 4, A17 should be A18.
Trademarks
Copyright © 2004 Advanced Micro Devices, Inc. All rights reserved.
AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.
ExpressFlash is a trademark of Advanced Micro Devices, Inc.
Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
LIT
LIT
CC3
CC1
L O
CC
: Added OE# and RESET to the Description column.
: Added OE# and RESET to the Description column.
, I
: Added Note 4, “I
, I
= V
C C 1
CC2
CC
, I
max”.
, I
CC3
C C 2
: Deleted “V
: D e l e t e d “ V
CC
CC3
specifications are tested with
= 20 µA max at extended
CC
C C
= V
= V
CC
max”; added
C C
m a x ” i n
Am29F800B
Revision D+2 (July 2, 1999)
Global
Added references to availability of device in Known
Good Die (KGD) form.
Revision E (November 16, 1999)
AC Characteristics—Figure 13. Program
Operations Timing and Figure 14. Chip/Sector
Erase Operations
Deleted t
high.
Physical Dimensions
Replaced figures with more detailed illustrations.
Revision E+1 (August 4, 2000)
Global
Added FBGA package.
Revision E+2 (June 4, 2004)
Ordering Information
Added Pb-Free OPNs.
GHWL
and changed OE# waveform to start at
45