AM29F800BB-90EC Spansion Inc., AM29F800BB-90EC Datasheet - Page 8

• Manufacturer Part Number: AM29F800BB-90EC
• Description: Flash Memory IC
• Manufacturer: Spansion Inc.

Specifications of AM29F800BB-90EC

• Memory Size: 8Mbit
• Memory Configuration: 1M X 8 / 512K X 16
• Ic Interface Type: Parallel
• Access Time: 90ns
• Memory Case Style: TSOP
• No. Of Pins: 48
• Mounting Type: Surface Mount
• Peak Reflow Compatible (260 C): No
• Supply Voltage Max: 5.5V
• Rohs Compliant: No
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

CONNECTION DIAGRAMS
This device is also available in Known Good Die (KGD) form. Refer to publication number 21631 for
more information.
Special Handling Instructions for FBGA
Package
Special handling is required for Flash Memory products
in FBGA packages.
8
RY/BY#
WE#
A13
A6
A5
A9
A4
A3
A2
A7
A1
A3
RY/BY#
DQ10
DQ11
DQ0
DQ8
DQ1
DQ9
DQ2
DQ3
OE#
RESET#
CE#
A18
A17
V
A7
A6
A5
A4
A3
A2
A1
A0
A12
A17
SS
NC
B6
B5
A8
B4
B3
B2
B1
A4
10
11
12
13
14
15
16
17
18
19
20
21
22
1
2
3
4
5
6
7
8
9
Top View, Balls Facing Down
A14
A10
A18
NC
C6
C5
C4
C3
C2
C1
A6
A2
Am29F800B
A15
A11
NC
NC
A5
A1
D6
D5
D4
D3
D2
D1
FBGA
SO
DQ7
DQ5
DQ2
DQ0
A16
Flash memory devices in FBGA packages may be
damaged if exposed to ultrasonic cleaning methods.
T h e p a c k a g e a n d / o r d a t a i n t e g r i t y m a y b e
compromised if the package body is exposed to
temperatures above 150°C for prolonged periods of
time.
E6
E5
E4
E3
E2
E1
A0
BYTE#
DQ14
DQ12
DQ10
DQ8
CE#
F6
F5
F4
F3
F2
F1
DQ15/A-1
DQ13
DQ11
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
DQ9
V
OE#
G6
G5
G4
G3
G2
G1
CC
RESET#
WE#
A8
A9
A10
A11
A12
A13
A14
A15
A16
BYTE#
V
DQ15/A-1
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
V
SS
CC
DQ6
DQ4
DQ3
DQ1
V
V
H6
H5
H4
H3
H2
H1
SS
SS