AM29LV160DB-70EC Spansion Inc., AM29LV160DB-70EC Datasheet - Page 8
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AM29LV160DB-70EC
Manufacturer Part Number
AM29LV160DB-70EC
Description
Flash Memory IC
Manufacturer
Spansion Inc.
Datasheet
1.AM29LV160DB-70EC.pdf
(52 pages)
Specifications of AM29LV160DB-70EC
Memory Configuration
2M X 8 / 1M X 16 Bit
Package/case
48-TSOP
Supply Voltage Max
3.6V
Leaded Process Compatible
No
Peak Reflow Compatible (260 C)
No
Access Time, Tacc
70nS
Mounting Type
Surface Mount
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AM29LV160DB-70EC
Manufacturer:
AMD
Quantity:
96
Company:
Part Number:
AM29LV160DB-70EC
Manufacturer:
AMD
Quantity:
2 380
Company:
Part Number:
AM29LV160DB-70EC
Manufacturer:
TSOP
Quantity:
2 500
Part Number:
AM29LV160DB-70EC
Manufacturer:
AMD
Quantity:
20 000
CONNECTION DIAGRAMS
Special Handling Instructions
Special handling is required for Flash Memor y
products in FBGA packages.
6
RY/BY#
WE#
A13
A6
A5
A4
A3
A2
A1
A9
A7
A3
RESET#
DQ10
DQ11
DQ0
DQ8
DQ1
DQ9
DQ2
DQ3
OE#
CE#
A18
A17
V
A7
A6
A5
A4
A3
A2
A1
A0
SS
RESET#
A12
A17
NC
B6
B5
A8
B4
B3
B2
B1
A4
10
11
12
13
14
15
16
17
18
19
20
21
22
1
2
3
4
5
6
7
8
9
A14
A10
A18
NC
C6
C5
C4
C3
C2
C1
A6
A2
D A T A
Top View, Balls Facing Down
Am29LV160D
A15
A11
A19
NC
D6
D5
D4
D3
D2
A5
D1
A1
SO
FBGA
S H E E T
Flash memory devices in FBGA packages may be
damaged if exposed to ultrasonic cleaning methods.
The package and/or data integrity may be compromised
if the package body is exposed to temperatures above
150°C for prolonged periods of time.
DQ7
DQ5
DQ2
DQ0
A16
E6
E5
E4
E3
E2
E1
A0
BYTE#
DQ14
DQ12
DQ10
DQ8
CE#
F6
F5
F4
F3
F2
F1
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
WE#
A19
A8
A9
A10
A11
A12
A13
A14
A15
A16
BYTE#
V
DQ15/A-1
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
V
DQ15/A-1
SS
CC
DQ13
DQ11
DQ9
OE#
V
G6
G5
G4
G3
G2
G1
CC
DQ6
DQ4
DQ3
DQ1
V
V
H6
H5
H4
H3
H2
H1
SS
SS
May 5, 2006 22358B7