AMP02FS Analog Devices Inc, AMP02FS Datasheet - Page 4

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AMP02FS

Manufacturer Part Number
AMP02FS
Description
Instrumentation Amplifier IC
Manufacturer
Analog Devices Inc
Datasheet

Specifications of AMP02FS

No. Of Amplifiers
2
Slew Rate
6V/µs
Amplifier Case Style
SOIC
No. Of Pins
16
Programmable Gain Max
10000
Mounting Type
Surface Mount
Supply Voltage Min
4.5V
Gain Min, V/v
1
Gain Max, V/v
10000
Rohs Status
RoHS non-compliant
Amplifier Type
Instrumentation
Number Of Circuits
1
-3db Bandwidth
1.2MHz
Current - Input Bias
4nA
Voltage - Input Offset
40µV
Current - Supply
5mA
Current - Output / Channel
32mA
Voltage - Supply, Single/dual (±)
±4.5 V ~ 18 V
Operating Temperature
-40°C ~ 85°C
Package / Case
16-SOIC (0.300", 7.5mm Width)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Output Type
-
Gain Bandwidth Product
-
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AMP02FS
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Part Number:
AMP02FSZ
Manufacturer:
ANALOGDEVICE
Quantity:
844
Part Number:
AMP02FSZ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
AMP02
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
AMP02 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
Parameter
Input Offset Voltage
Output Offset Voltage
Power Supply
Rejection
Input Bias Current
Input Offset Current
Input Voltage Range
Common-Mode
Rejection
Gain Equation Accuracy
Output Voltage Swing
Supply Current
*Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not
WAFER TEST LIMITS*
guaranteed for standard product dice. Consult factory to negotiate specifications based on dice lot qualifications through sample lot assembly and testing.
(@ V
1
Symbol
V
V
PSR
I
I
IVR
CMR
V
I
DIE SIZE 0.103 inch
8
B
OS
SY
S
NOTE: PINS 1 and 8 are KELVIN CONNECTED
IOS
OOS
OUT
=
(2.62 mm
15 V, V
CM
2.95 mm, 7.73 sq. mm)
= 0 V, T
0.116 inch, 11,948 sq. mils
G = 10
Guaranteed by CMR Tests
G = 100
G = 10
Conditions
V
G = 1000
G = 100
G = 1
V
G = 1000
G = 1
R
G =
Die Characteristics
S
CM
L
= ± 4.8 V to ± 18 V
= 1 kΩ
50 kΩ
A
= ± 11 V
R
= 25 C, unless otherwise noted.)
G
–4–
+ 1, G = 1000
1. RG
2. –IN
3. +IN
4. V–
5. REFERENCE
6. OUT
7. V+
8. RG
9. SENSE
CONNECT SUBSTRATE TO V–
1
2
AMP02 GBC
200
8
110
110
95
75
20
10
± 11
110
110
95
75
0.7
± 12
6
Limits
Unit
µV max
mV max
dB
nA max
nA max
V min
dB
% max
V min
mA max
REV. E

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