AMP02FSZ-RL Analog Devices Inc, AMP02FSZ-RL Datasheet - Page 3
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AMP02FSZ-RL
Manufacturer Part Number
AMP02FSZ-RL
Description
SOL-16 WITH TAPE & REEL
Manufacturer
Analog Devices Inc
Type
Instrumentation Ampr
Datasheet
1.AMP02FSZ-RL.pdf
(12 pages)
Specifications of AMP02FSZ-RL
Amplifier Type
Instrumentation
Number Of Circuits
1
Slew Rate
6 V/µs
-3db Bandwidth
1.2MHz
Current - Input Bias
4nA
Voltage - Input Offset
40µV
Current - Supply
5mA
Current - Output / Channel
32mA
Voltage - Supply, Single/dual (±)
±4.5 V ~ 18 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
16-SOIC (0.300", 7.5mm Width)
Number Of Channels
1
Number Of Elements
1
Power Supply Requirement
Dual
Common Mode Rejection Ratio
75dB
Voltage Gain Db
80dB
Input Resistance
16500@±15VMohm
Input Offset Voltage
0.2@±15VmV
Input Bias Current
0.02@±15VnA
Single Supply Voltage (typ)
Not RequiredV
Dual Supply Voltage (typ)
±5/±9/±12/±15V
Power Supply Rejection Ratio
75dB
Rail/rail I/o Type
No
Single Supply Voltage (min)
Not RequiredV
Single Supply Voltage (max)
Not RequiredV
Dual Supply Voltage (min)
±4.5V
Dual Supply Voltage (max)
±18V
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
16
Package Type
SOIC W
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Output Type
-
Gain Bandwidth Product
-
Lead Free Status / Rohs Status
Compliant
ABSOLUTE MAXIMUM RATINGS
Supply Voltage
Common-Mode Input Voltage [(V–) – 60 V] to [(V+) + 60 V]
Differential Input Voltage
Output Short-Circuit Duration
Operating Temperature Range
Storage Temperature Range
Function Temperature Range
Lead Temperature (Soldering, 10 sec)
Package Type
8-Lead Plastic DIP (P)
16-Lead SOIC (S)
REV. E
Parameter
POWER SUPPLY
NOTES
1
2
3
Specifications subject to change without notice.
Input voltage range guaranteed by common-mode rejection test.
Guaranteed by design.
Gain tempco does not include the effects of external component drift.
Supply Voltage Range
Supply Current
–IN
Model
AMP02EP
AMP02FP
AMP02AZ/883C
AMP02FS
AMP02GBC
AMP02FS-REEL 200 µV
Symbol
V
I
96
92
SY
S
JA
3
[(V–) – 60 V] to [(V+) + 60 V]
1, 2
37
27
Conditions
T
–40°C ≤ T
JC
A
V
T
100 µV
200 µV
200 µV
200 µV
–65°C to +150°C
–65°C to +150°C
IOS
= 25°C
A
R
–40°C to +85°C
G1
= 25 C
max @ V
R
Figure 2. Simplified Schematic
G2
Continuous
A
≤ +85°C
Unit
°C/W
°C/W
ORDERING GUIDE
300°C
T
4 mV
8 mV
10 mV
8 mV
8 mV
± 18 V
OOS
A
= 25 C
max @ Temperature
–3–
NOTES
1
2
3
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specifications is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
Absolute maximum ratings apply to both DICE and packaged parts, unless
otherwise noted.
θ
device in socket for P-DIP package; θ
printed circuit board for SOIC package.
Range
–40°C to +85°C
–40°C to +85°C
–55°C to +125°C
–40°C to +85°C
–40°C to +85°C
Min
± 4.5
JA
is specified for worst case mounting conditions, i.e., θ
AMP02E
Typ
5
5
25k
25k
Package
Description
8-Lead Plastic DIP
8-Lead Plastic DIP
8-Lead CERDIP
16-Lead SOIC
Die
16-Lead SOIC
Max
± 18
6
6
+IN
Min
± 4.5
25k
25k
JA
is specified for device soldered to
AMP02F
Typ
5
5
Max
± 18
6
6
JA
V+
SENSE
OUT
REFERENCE
V–
is specified for
AMP02
Unit
V
mA
mA