CY7C68013A-56LTXCT Cypress Semiconductor Corp, CY7C68013A-56LTXCT Datasheet - Page 37

• Manufacturer Part Number: CY7C68013A-56LTXCT
• Description: CY7C68013A-56LTXCT
• Manufacturer: Cypress Semiconductor Corp
• Series: EZ-USB FX2LP™r

Specifications of CY7C68013A-56LTXCT

• Applications: USB Microcontroller
• Core Processor: 8051
• Program Memory Type: ROMless
• Controller Series: CY7C680xx
• Ram Size: 16K x 8
• Interface: I²C, USB, USART
• Number Of I /o: 24
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 56-VQFN Exposed Pad, 56-HVQFN, 56-SQFN, 56-DHVQFN
• Processor Series: CY7C68xx
• Core: 8051
• Development Tools By Supplier: CY3684
• Package: 56QFN EP
• Device Core: 8051
• Family Name: FX2LP
• Maximum Speed: 48 MHz
• Operating Supply Voltage: 3.3 V
• Data Bus Width: 8 Bit
• Number Of Programmable I/os: 24
• Interface Type: I2C/USART/USB
• Number Of Timers: 3
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: CY4611B - KIT USB TO ATA REFERENCE DESIGN428-1677 - KIT DEVELOPMENT EZ-USB FX2LP
• Lead Free Status / Rohs Status: Details

5. Absolute Maximum Ratings
Exceeding maximum ratings may shorten the useful life of the
device. User guidelines are not tested.
Storage temperature ................................ –65 °C to +150 °C
Ambient temperature with
power supplied (commercial).......................... 0 °C to +70 °C
Ambient temperature with
power supplied (industrial)....................... –40 °C to + 105 °C
Supply voltage to ground potential ...............–0.5 V to +4.0 V
DC input voltage to any input pin
DC voltage applied to outputs
in high Z state ..................................... –0.5 V to V
Power dissipation ..................................................... 300 mW
Static discharge voltage............. ...............................>2000 V
Max output current, per I/O port .................................. 10 mA
Max output current, all five I/O ports
(128-pin and 100-pin packages) .................................. 50 mA
7. Thermal Characteristics
The following table displays the thermal characteristics of various packages:
Table 12. Thermal Characteristics
The junction temperature θ
Where,
P = Power
θ
θ
The case temperature θ
where,
P = Power
θ
θ
Document #: 38-08032 Rev. *U
Package
56 SSOP
100 TQFP
128 TQFP
56 QFN
56 VFBGA
Note
Ja
a
Ca
a
15. Do not power I/O with chip power off.
= Ambient temperature (70 °C)
= Ambient temperature (70 °C)
= Junction to ambient temperature (θ
= Case to ambient temperature
Temperature
Ambient
(°C)
70
70
70
70
70
c
, can be calculated using the following equation: θ
j
, can be calculated using the following equation: θ
[15]
............................ 5.25 V
Thermal Resistance
Junction to Case
Jc
+ θ
(°C/W)
24.4
11.9
15.5
10.6
30.9
θ
Ca
Jc
)
CC
+ 0.5 V
Junction to Ambient
Thermal Resistance
6. Operating Conditions
T
Commercial .................................................... 0 °C to +70 °C
T
Industrial ................................................... –40 °C to +105 °C
Supply voltage ..........................................+3.00 V to +3.60 V
Ground voltage ................................................................. 0 V
F
A
A
OSC
(°C/W)
(ambient temperature under bias)
(ambient temperature under bias)
θ
47.7
45.9
43.2
25.2
58.6
Ja
(oscillator or crystal frequency) ..... 24 MHz ± 100 ppm,
c
= P*θ
j
= P*θ
Ca
Ja
+ θ
CY7C68013A, CY7C68014A
CY7C68015A, CY7C68016A
+ θ
a
a
parallel resonant
Page 37 of 67
[+] Feedback